Automatic Die Attach Operator 3 - 2nd Shift

MACOM Technology Solutions Holdings, Inc.•Nashua, NH

About The Position

The Assembler 3 – Datacon Auto Die Attach Operations supports semiconductor die attach production using automated Datacon equipment in accordance with documented manufacturing procedures. The role involves loading materials, monitoring automated die attach processes, verifying process outputs, and completing production documentation while complying with quality, safety, ESD, and semiconductor manufacturing standards. The position does not include manual assembly, soldering, laser marking, or laser serialization. Work is performed under direct to moderate supervision, depending on experience level. The work is performed in an ESD-controlled or clean manufacturing environment and involves repetitive tasks, careful material handling, and extended use of microscopes, inspection tools, and computer-based manufacturing systems.

Requirements

High school diploma or equivalent.
Ability to read, understand, speak, and write English fluently to support safety, quality, and documentation requirements.
Ability to follow structured processes and work in a detail-oriented automated manufacturing environment.
Basic understanding of semiconductor manufacturing, die attach, or precision automated equipment concepts.
Ability to follow documented procedures, travelers, and verbal instructions.
Basic computer proficiency, including data entry and navigating manufacturing systems.
Ability to operate Datacon auto die attach equipment after training.
Understanding of ESD fundamentals and clean handling practices.
Ability to perform repetitive tasks requiring careful material handling and attention to detail.
Ability to use microscopes, inspection tools, and computer-based manufacturing systems for extended periods.

Responsibilities

Operate Datacon auto die attach equipment in accordance with drawings, travelers, work instructions, and process requirements.
Load and handle wafers, substrates, die, tools, and related materials using approved semiconductor handling practices.
Monitor automated die attach operations and verify placement accuracy, bond quality, alignment, and other process outputs using appropriate inspection tools.
Execute work in compliance with semiconductor manufacturing requirements, including ESD control, contamination awareness, and process discipline.
Identify and escalate equipment alarms, material issues, process deviations, or quality concerns to the appropriate lead, technician, or engineer.
Accurately record production data and complete electronic and paper-based documentation to support traceability requirements.
Maintain a safe, clean, and organized workspace in accordance with EHS and company policies.