Element Attach Operator I
About The Position
Operate automatic epoxy dispensing, screen printing, and microelectronic component placement equipment in a clean-room environment to manufacture high-reliability microelectronic devices. The role includes assembling and reworking fine-pitched microelectronic components while following work instructions, ESD requirements, and quality and production standards. The position requires cleanroom gowning and precision work with tools and equipment including tweezers, knives, vacuum pencils, probes, calipers, scales, and a hot plate. Candidates being considered for hire must pass a pre-employment background check and drug test, including screening for illegal drugs and marijuana.
Requirements
- Visual acuity and fine motor skills to perform precision work with tooling under a microscope.
- Ability to meet cleanroom gowning requirements, including smocks, hairnets, and masks.
- Intermediate English literacy, including the ability to read and write.
- Ability to collaborate in a fast-paced team environment to meet quality and production goals.
- Ability to work on multiple tasks using a range of procedures with low-level complexity.
- Ability to follow established procedures for routine work.
- High school diploma, GED, or equivalent experience preferred.
- Experience using Windows operating systems, including Microsoft Office products.
- Must pass a pre-employment background check and drug test, including screening for illegal drugs and marijuana.
Nice To Haves
- Experience working for an ISO 9000- or AS9100-accredited organization is a plus.
Responsibilities
- Read and interpret assembly instructions, drawings, and work instruction processes.
- Set up and operate epoxy dispensing equipment.
- Set up and operate pick-and-place machines.
- Complete written tests for ESD, manual die attach, and automatic die attach requirements.
- Handle fine-pitched microelectronic components, including dies, air-bridge dies, capacitors, resistors, substrates, and hybrids, as well as epoxy and cut preforms used in assembly.
- Open and close die waffle packs and handle air-bridge die gel packs.
- Hand-apply epoxy and solder on densely populated substrate pads without disturbing epoxy on neighboring pads.
- Manually place components on substrates without disturbing neighboring wet assemblies.
- Rework substrates by removing epoxy, dies, and other components, then applying fresh epoxy and installing replacement components using applicable tools and a hot plate.
- Follow work instructions and procedures and adhere to ESD and other handling requirements.
- Complete in-house training identified in the job-specific family or training plan.
- Follow company 6S and continuous-improvement (kaizen) objectives.
- Perform other duties as assigned.
- Support at least two customer products while maintaining quality and production standards.
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What This Job Offers
Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED
