DEMQRA DQA WLR Technician

Micron•Boise, ID

14d

About The Position

Micron Technology is seeking a DEMQRA DQA WLR Technician to support semiconductor assembly, reliability testing, and manufacturing operations. The role performs die attach and wire bonding, runs electromigration and reliability stress tests, records test results, and supports assembly and test equipment maintenance. The technician also contributes to smart-manufacturing initiatives by using AI tools to document shift activities and production issues and by providing feedback on automated workflows. The position works closely with engineering on sample builds, process changes, and failure analysis, while following and improving technical work instructions and safety procedures. The work involves precision assembly under microscopes, cleanroom gowning as required, and handling chemicals and adhesives according to site safety procedures and SDS requirements. Micron describes its benefits as supporting employee wellbeing, income protection, family leave, and time off.

Requirements

Associate degree in electronics, engineering technology, manufacturing, or a related technical field, or equivalent hands-on experience in semiconductor assembly, test, or a comparable precision manufacturing environment.
Comfort working under microscopes and handling small-geometry parts that require fine motor precision.
Basic computer skills, including data entry, spreadsheets, and test-system software.
Ability to read and follow detailed technical work instructions.
Strong attention to detail and consistent documentation habits.

Nice To Haves

Wire bonding experience, including ball or wedge bonding.
Die attach experience, including automated die bonder operation and programming.
Electromigration or reliability test experience, including stress test setup, high-temperature ovens, and parametric data collection.
Experience setting up automated assembly equipment, editing recipes, and using vision/alignment systems.
Background in a cleanroom or controlled manufacturing environment.

Responsibilities

Perform die attach using automated die bonders, including dispensing conductive adhesives, placing and aligning dies, and applying cure/fire profiles.
Wire bond assembled devices and verify bond quality against established criteria.
Set up, run, and monitor electromigration and reliability stress tests.
Collect, organize, and report test data.
Troubleshoot equipment and support preventive maintenance and calibration of assembly and test tooling.
Schedule preventive maintenance and service calls with vendors.
Purchase parts and services through Ariba.
Use Copilot or similar AI tools to summarize shift activities, generate maintenance reports, and document production issues.
Provide operator feedback to support smart-manufacturing initiatives, AI tools, and automated workflows.
Follow and help improve written work instructions, process documentation, and safety procedures.
Partner with engineering on new sample builds, process changes, and failure analysis support.