Advanced Packaging Patterning Engineer - Staff

Skywater•Kissimmee, FL

2d•Onsite

About The Position

The Staff Advanced Packaging Patterning Engineer will lead the development and improvement of patterning process flows at the company’s Florida Advanced Packaging site, delivering qualified products for foundry clients. The role translates client package requests into module process flows that may use silicon interposers, FanOut, superconducting materials, and hybrid bonding. The engineer identifies development needs, coordinates module teams to deliver on schedule and with high yield, identifies process-flow gaps, and develops external partnerships to support rapid prototyping. When needed, the engineer leads task forces to find root causes, correct issues, and maintain product deliverables. The position supports integration engineers on project-specific process needs and develops recipes based on the capabilities and interdependencies of process toolsets. Patterning processes include liquid and dry film application, exposure, development, and stripping. The role enables patterning for devices serving MEMS, photonics, high-performance computing, CMOS, memory, AI, and quantum applications; integrates TSV-first and/or TSV-last flows; and uses metrology and data analysis to characterize processes, investigate defects, and guide decisions. The engineer also drives integration changes to improve device performance and yield, works with process and tool engineers to address process marginalities, monitors SPC charts, supports electrical test parametrics, and creates rapid learning cycles to identify issues and deliver final products and process flows. Other duties may be assigned. Estimated time spent on duties may vary. The role requires strong oral and written communication with foundry customers, colleagues, and management. U.S. citizenship is required because the position requires holding or being able to obtain a government security clearance.

Requirements

Bachelor of Science in Engineering.
At least 5 years of process development and integration experience in an advanced packaging fab environment, including 10K and 1K clean rooms, related to FanOut wafer-level assembly, quantum, silicon interposer, and hybrid bonding.
Design enablement skills in reticle layouts and reviews, and test-site installation.
Knowledge of or experience with advanced packaging fab processing tools.
Relevant combination of experience and/or advanced degree in MEMS, photonic, HPC, AI, ASIC, or quantum devices and integration.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving capability; data-driven, inventive, and solution-oriented approach; and ability to articulate thought processes.
Ability to work independently and in cross-functional teams.
Strong oral and written communication skills for communicating with foundry customers, colleagues, and management.
U.S. citizenship; must hold or be able to obtain a government security clearance.

Nice To Haves

Master’s or Ph.D. degree.
Project management skills and/or defined project management training.

Responsibilities

Translate client package requests into module process flows, potentially using silicon interposers, FanOut, superconducting materials, and hybrid bonding.
Identify process development needs and lead module teams to deliver qualified products on schedule and with high yield.
Identify process-flow gaps and build external partnerships to enable fast-turn prototyping.
Lead task forces, when required, to identify root causes, correct issues, and maintain product deliverables.
Support integration engineers in enabling new process needs for each project.
Use knowledge of process tool capabilities and interdependencies to create recipes for patterning processes, including liquid and dry film application, exposure, development, and stripping.
Enable patterning for devices across MEMS, photonics, high-performance computing, CMOS, memory, AI, and quantum applications.
Integrate TSV-first and/or TSV-last process flows for foundry client packages.
Use metrology tools to characterize process conditions, identify defect root causes, and document results.
Investigate and drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify processing marginalities and implement improvements.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that may be addressed through integration changes.
Use data analysis software to support data-driven decisions.
Create quick-turn learning cycles to identify issues early and establish final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parametrics to deliver electrically good final packages.
Perform other duties as assigned.