Advanced Packaging Die Placement Engineer - Staff

SkyWater Technology Foundry, Inc.•Kissimmee, FL

3d•$95,200 - $142,800•Onsite

About The Position

SkyWater is seeking an experienced Die Placement / Pick and Place Development Engineer for its Florida Advanced Packaging site. The engineer will lead, develop, and improve die-placement process flows to deliver qualified products to foundry clients. The role requires strong oral and written communication to convey ideas to customers, colleagues, and management. The position translates client package requests into die-placement and pick-and-place process flows. These may involve silicon interposers, FanOut, superconducting materials, hybrid bonding, wafer-level assembly, or substrate assembly. The engineer identifies development needs, leads module teams to deliver qualified products on schedule and with high yield, identifies process-flow gaps, and builds external partnerships for rapid prototyping. The role also supports integration engineers, creates training materials and technical papers, and applies knowledge of tool capabilities and process dependencies to develop appropriate recipes. The engineer integrates processes for clients across MEMS, photonics, high-performance computing, CMOS, memory, AI, and quantum devices, including TSV-first and/or TSV-last flows. The work includes using metrology and data-analysis tools to characterize processes, investigate defects and root causes, drive integration changes for improved performance and yield, address process marginalities with process and tool engineers, monitor SPC charts, and incorporate electrical-test parametrics into product improvement. Quick learning cycles are used to identify issues early and establish final product and process flows. Other duties may be assigned.

Requirements

Bachelor of Science in Engineering.
At least 5 years of process development and integration engineering experience in an advanced-packaging fab environment with 10K and 1K clean rooms, related to FanOut wafer-level assembly, quantum, silicon interposer, and hybrid bonding.
Knowledge of or experience with advanced-packaging fab processing tools.
Relevant MEMS, photonic, HPC, AI, ASIC, or quantum device and integration knowledge, supported by an appropriate combination of years of experience and/or an advanced degree.
Knowledge and application of DOE, SPC, and Six Sigma concepts.
Clear problem-solving capability; data-driven and inventive solution orientation; ability to articulate thought processes.
Ability to work independently and in cross-functional teams.
U.S. citizenship; the position requires holding or being able to obtain a government security clearance, which requires U.S. citizenship.

Nice To Haves

Master’s or Ph.D. degree.
Project management skills and/or formal project management training.

Responsibilities

Translate client package requests into die-placement and pick-and-place process flows, potentially involving silicon interposers, FanOut, superconducting materials, hybrid bonding, wafer-level assembly, or substrate assembly.
Identify process-development needs and lead module teams to deliver qualified products on schedule and with high yield.
Identify process-flow gaps and build external partnerships to enable fast-turn prototyping.
Lead task forces when needed to determine root causes, correct issues, and maintain product deliverables.
Support integration engineers in enabling new process needs for each project.
Create training documents and write technical papers to teach state-of-the-art technologies internally and externally.
Apply knowledge of process-tool capabilities and dependencies to create recipes that account for upstream and downstream product requirements and process flows.
Integrate processes for clients working with MEMS, photonics, HPC, CMOS, memory, AI, and quantum devices.
Integrate TSV-first and/or TSV-last process flows for foundry-client packages.
Use metrology tools to characterize process conditions, identify defect root causes, and document results.
Investigate and drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify processing marginalities and implement improvements.
Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that may be addressed through integration changes.
Use data-analysis software to support data-driven decisions.
Create quick-turn learning cycles to identify issues early and develop final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical-test parametrics to deliver electrically good final packages.
Perform other duties as assigned.