Advanced Packaging Die Placement Engineer - Staff

Skywater•Kissimmee, FL

About The Position

SkyWater is seeking an experienced Die Placement / Pick and Place Development Engineer for its Florida Advanced Packaging site. The engineer will lead, develop, and improve die placement process flows to deliver qualified products to foundry clients. The role involves translating client package requests into die placement and pick-and-place process flows, potentially using silicon interposers, FanOut, superconducting materials, hybrid bonding, wafer-level assembly, or substrate assembly. The engineer will support integration across projects for clients in MEMS, photonics, high-performance computing, CMOS, memory, AI, ASIC, and quantum devices. The position requires communication with foundry customers, colleagues, and management, and includes preparing training documents and technical papers on advanced technologies.

Requirements

BS in Engineering.
At least 5 years of process development and integration engineering experience in an advanced-packaging fab environment, including 10K and 1K clean rooms, related to FanOut wafer-level assembly, quantum, silicon interposer, and hybrid bonding.
Knowledge or experience with advanced-packaging fab processing tools.
Relevant combination of experience and/or advanced degree in MEMS, photonic, HPC, AI, ASIC, or quantum devices and integration.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving ability; data-driven, inventive, and solution-oriented approach; ability to articulate thought processes.
Ability to work independently and in cross-functional teams.
U.S. citizenship; the position requires holding or being able to obtain a government security clearance.
Excellent oral and written communication skills for communicating with foundry customers, colleagues, and management.

Nice To Haves

MS or PhD.
Project management skills and/or formal project management training.

Responsibilities

Translate client package requests into die placement and pick-and-place process flows using applicable packaging and assembly technologies.
Identify development needs and lead module teams to deliver qualified products on schedule and with high yield.
Identify process-flow gaps and build external partnerships to enable rapid-turn prototyping.
Lead task forces as needed to determine root causes, correct issues, and maintain product deliverables.
Support integration engineers in meeting new process requirements for each project.
Create training documents and write technical papers to teach state-of-the-art technologies internally and externally.
Use knowledge of tool-set capabilities and process interdependencies to create recipes that account for upstream and downstream product requirements and process flows.
Integrate processes for clients and devices spanning MEMS, photonics, HPC, CMOS, memory, AI, and quantum applications.
Integrate TSV-first and/or TSV-last process flows for foundry client packages.
Use metrology tools to characterize process conditions, identify defect root causes, and document results.
Investigate and drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify process marginalities and make improvements.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that may be addressed through integration changes.
Use data-analysis software to support data-driven decisions.
Run quick-turn learning cycles to identify issues early and develop final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parametrics to deliver electrically good final packages.
Perform other duties as assigned.