Advanced Packaging Patterning Engineer - Staff

SkyWater Technology Foundry, Inc.•Kissimmee, FL

3d•$95,200 - $142,800•Onsite

About The Position

SkyWater is seeking an experienced Patterning Development Engineer for its Florida Advanced Packaging site. The engineer will lead, develop, and improve patterning process flows to deliver qualified products to foundry clients. The role requires strong written and oral communication to explain ideas to customers, colleagues, and management. The engineer translates client package requests into module process flows that may use silicon interposers, FanOut, superconducting materials, and hybrid bonding. They identify development needs and process gaps, lead teams toward on-schedule, high-yield products, and build external partnerships to support rapid prototyping. The role also supports integration engineers, process and tool engineers, and cross-functional task forces to resolve issues and improve device performance and yield. The position uses knowledge of advanced packaging tools and patterning processes—including liquid and dry film application, exposure, development, and stripping—to support devices across MEMS, photonics, high-performance computing, CMOS, memory, AI, quantum, and other areas. Responsibilities include integrating TSV-first and/or TSV-last flows, using metrology and data analysis to characterize processes and investigate defects, monitoring SPC trends, managing electrical test parametrics, and creating rapid learning cycles for client products and process flows. Other duties may be assigned. The position requires U.S. citizenship because it requires holding or being able to obtain a government security clearance. The annual salary range is $95,200–$142,800. SkyWater describes an environment focused on semiconductor technology development and offers competitive pay and participation in incentive plans.

Requirements

Bachelor of Science in Engineering.
At least 5 years of process development and integration experience in an advanced packaging fab environment, including 10K and 1K clean rooms, related to FanOut wafer-level assembly, quantum, silicon interposer, and hybrid bonding.
Design enablement skills in reticle layouts and reviews, and test-site installation.
Knowledge of or experience with advanced packaging fab processing tools.
MEMS, photonics, HPC, AI, ASIC, or quantum device and integration knowledge, with a relevant combination of years of experience and/or advanced degree.
Knowledge of DOE, SPC, and Six Sigma concepts and applications.
Clear problem-solving capability; data-driven, inventive, solution-oriented approach; and ability to articulate thought processes.
Ability to work independently and in cross-functional teams to solve problems.
U.S. citizenship; the position requires holding or being able to obtain a government security clearance.
Excellent oral and written communication skills.

Nice To Haves

Master's or Ph.D. degree.
Project management skills and/or defined project management training.

Responsibilities

Lead, develop, and improve patterning process flows to deliver qualified products to foundry clients.
Translate client package requests into module process flows, potentially involving silicon interposers, FanOut, superconducting materials, and hybrid bonding.
Identify process development needs and gaps, and lead module teams to deliver qualifiable products on schedule and with high yield.
Build external partnerships to enable fast-turn prototyping.
Lead task forces, when required, to identify root causes, correct issues, and maintain product deliverables.
Support integration engineers in enabling new process needs for each project.
Use knowledge of tool-set capabilities and interdependencies to create patterning recipes, including liquid and dry film application, exposure, development, and stripping.
Enable patterning for devices and clients across MEMS, photonics, high-performance computing, CMOS, memory, AI, and quantum technologies.
Integrate TSV-first and/or TSV-last process flows for foundry client packages.
Use metrology tools to characterize process conditions, identify defect root causes, and document results.
Investigate and drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify processing marginalities and make improvements.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that may be addressed through integration changes.
Use data analysis software to support data-driven decisions.
Create rapid cycles of learning to identify issues early and establish final products and process flows for foundry clients.
Incorporate, monitor, and improve electrical test parametrics to deliver electrically good final packages.
Perform other duties as assigned.