Advanced Packaging Engineer
About The Position
You will contribute to and own aspects of the Volantis A-0 and A-1 package. We are interested in both people with package design as well as package process development backgrounds. Our end goal has challenges to overcome in warpage, CTE mismatch, thermomechanical aspects, assembly speed and more. We're building a wafer-scale package with both silicon and compound semiconductor dies sitting together at very high TDP. This creates both unique challenges and opportunities. The end result is breaking the memory wall, enabling a new era of AI, and a platform that scales another 1-3 orders of magnitude.
Requirements
- Ability to think from first principles about novel problems- not just applying existing solutions outside of their range of application.
- Design or process development of complex packages
Nice To Haves
- Experience with heterogeneous material assemblies
- Experience with high-TDP packages
- Experience with compound semiconductor assemblies
- Experience with co-packaged optics
- Ability to work with architects to co-design system architecture and package design
- Experience with interposer platforms such as CoWoS, CoWoS-L, CoWoS-R, EMIB, FoCoS, FoCoS-Bridge, etc
- Experience with flip-chip integration, especially mass reflow, TCB & LAB
- Experience with large scale (>50x50mm) substrates
Responsibilities
- Contribute to and own aspects of the Volantis A-0 and A-1 package.
Benefits
- Competitive Base salary
- Significant Equity Stake
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Job Type
Full-time
Career Level
Senior
Education Level
No Education Listed
