Thermo-Mechanical, CFD Simulation Engineering Intern
Etched•San Jose, CA
•Onsite
About The Position
We are seeking a talented Thermo-Mechanical, CFD Simulation Engineering Intern focused on Chip-on-Wafer-on-Substrate (CoWoS) package development to join our Advanced IC Packaging Team. You'll use tools like ANSYS Mechanical APDL and ANSYS FLUENT to perform critical thermo-mechanical/CFD analysis and contribute to next-generation high-performance computing systems.
Requirements
- Pursuing a degree in Mechanical Engineering or related field
- Academic or project experience with FEA/CFD tools and analysis
- Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT
- Understanding of semiconductor packaging materials and processes
- Strong grasp on non-linear properties of materials (elastic-plastic, viscoelastic)
- Familiarity with CoWoS-S/L/R, TSVs, or 2.5D/3D integration concepts
- Basic programming/scripting skills (APDL, Python, MATLAB)
Nice To Haves
- Knowledge of solder joint reliability and failure analysis
- Familiarity with JEDEC standards and reliability testing
- Previous internship in semiconductor industry
Responsibilities
- Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL
- Perform thermo-mechanical stress/strain analysis and thermal cycling simulations
- Analyze package warpage, solder joint reliability, and interconnect stress
- Develop CFD models using ANSYS FLUENT for solder reflow modeling
- Collaborate with design engineering teams on package development
Benefits
- 12-week paid internship
- Generous housing support for those relocating
- Daily lunch and dinner in our office
- Direct mentorship from industry leaders and world-class engineers
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What This Job Offers
Career Level
Intern
Education Level
Associate degree
