Structural Analyst

Viasat, Inc. • Remote (excluding ND, VT, or RI), UNAVAILABLE

3h

About The Position

At Viasat, the Structural Analyst performs detailed structural analysis of spacecraft primary and secondary structures, payload components, mechanisms, ground support equipment, electronic packaging, and composites. The role uses finite element analysis and hand calculations, develops conceptual structural models for proposals and trade studies, and produces stress reports and presentation materials for design reviews.

The analyst evaluates the structural effects of design changes, materials, manufacturing processes, and interfaces; supports structural testing through test-plan development, fixture design, FEM correlation, and requirements verification; and works with mechanical design, systems, materials, and thermal engineering teams to optimize hardware performance. The role applies aerospace best practices and relevant NASA, AIAA, ECSS, and military standards, and communicates analysis results to program teams, leadership, and external customers.

Requirements

• B.S. in Mechanical Engineering, Aerospace Engineering, or a related field.
• At least 4 years of relevant experience in structural analysis of spaceflight hardware.
• Proficiency with Nastran (MSC or Simcenter) for static, normal modes, buckling, and frequency response analysis.
• Proficiency with Simcenter Femap modeling and post-processing.
• Working knowledge of standard aerospace engineering materials, processes, and parts, including metallics, polymers, composites, and fasteners.
• Working knowledge of aerospace structural analysis and test methodologies, including static analysis and testing; normal modes and linear dynamics; random vibration and shock response analysis and testing; fatigue and fracture mechanics; composite materials and classical laminate theory; mechanism analysis; thermoelastic analysis; launch vehicle environments; semi-empirical methods such as Bruhn and ECSS; and bonded and bolted joint analysis.
• Working knowledge of electronic packaging structural analysis, including printed wiring assembly structural analysis, solder-joint fatigue and Steinberg random vibration fatigue methods, connector and interconnect reliability, and thermal-mechanical coupled analysis of electronic assemblies.
• Demonstrated experience applying NASA, AIAA, ECSS, and MIL standards to structural design, testing, and qualification.
• Ability to generate high-quality analysis documentation.
• Strong knowledge of mechanical design principles.
• Excellent communication skills and ability to work cross-functionally in a multidisciplinary team.
• U.S. citizenship and ability to obtain a Secret-level security clearance.

Nice To Haves

• M.S. in Mechanical Engineering, Aerospace Engineering, or a related field.
• Experience with LS-DYNA, ANSYS, or Abaqus.
• Experience with nonlinear and thermal-structural coupled analyses.
• Experience with vibroacoustic analysis.
• Coding experience using Python or MATLAB.

Responsibilities

• Perform detailed structural analyses of spacecraft structures, payload components, mechanisms, ground support equipment, electronic packaging, and composites using finite element analysis and hand calculations.
• Develop conceptual structural models to support proposals and trade studies.
• Produce stress reports and slide packages for design reviews.
• Evaluate structural impacts of design changes, materials, manufacturing processes, and interfaces.
• Support structural testing, including test-plan development, fixture design, FEM correlation, and verification of requirements.
• Collaborate with mechanical design engineers, systems engineers, materials engineers, and thermal analysts to optimize hardware performance.
• Apply applicable aerospace standards, including NASA, AIAA, ECSS, and military standards, to structural design, testing, and qualification.
• Communicate analysis results to program teams, leadership, and external customers.

Benefits

• Medical, financial, and/or other benefits, dependent on the position offered.
• Additional cash or stock incentives may be provided as part of the compensation package.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level