Micron Technology is seeking a HBM Product Yield Enhancement Product Development Failure Analysis Engineer in Boise, Idaho. The engineer will work on the Product Development Failure Analysis team to help take next-generation HBM devices from design to mass production. The role focuses on product reliability and component failure analysis during new HBM product introductions to support rapid production ramps and early time to market. The position uses electrical and physical characterization techniques, AI tools, and statistical analysis to identify failures related to fabrication and assembly processes, as well as test marginalities. The engineer coordinates component-level improvement activities with Product, Process, Quality, and Test Engineering teams.
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Job Type
Full-time
Career Level
Senior