New College Grad - HBM PYE Product Development Failure Analysis Enginee
About The Position
The Product Development Failure Analysis (PDFA) team supports next-generation High Bandwidth Memory (HBM) products from initial design through high-volume manufacturing. It works with Product, Process, Quality, and Test Engineering organizations to identify, analyze, and resolve product- and process-related issues affecting yield, reliability, and product performance. In this role, the engineer focuses on product reliability and component-level failure analysis during new HBM product introductions. The work uses electrical characterization, physical analysis techniques, statistical methodologies, and AI-enabled data analysis tools to identify failure mechanisms and support a rapid production ramp. The role requires analytical skills, cross-functional collaboration, and the ability to turn complex data into actionable engineering solutions.
Requirements
- Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related technical field, or equivalent experience.
- Experience or coursework in semiconductor device physics, semiconductor manufacturing processes, or VLSI design.
- Knowledge of statistical analysis techniques and data-driven problem solving.
- Experience using Python or similar programming languages for data analysis and engineering applications.
- Ability to analyze complex technical data and communicate findings effectively in a collaborative engineering environment.
Nice To Haves
- Master's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field.
- Academic or industry experience in semiconductor failure analysis, yield enhancement, reliability engineering, or product characterization.
- Experience applying AI, Generative AI, or AI-assisted analytical tools to support engineering investigations and data analysis.
- Knowledge of test methodologies, process integration, and advanced memory technologies, including HBM products.
- Experience with large datasets and statistical software or machine learning techniques to identify failure trends and process improvements.
Responsibilities
- Perform electrical, physical, and statistical failure analysis to identify and understand component failure mechanisms.
- Analyze characterization and manufacturing data to determine root causes of fabrication-, assembly-, and test-related failures.
- Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process defect issues.
- Use AI-enabled tools and statistical methods to evaluate large datasets, identify trends, and improve component performance.
- Communicate findings, corrective actions, and risk assessments to cross-functional partners to support product qualification and production ramp.
Benefits
- Choice of medical, dental, and vision plans.
- Programs to protect income in the event of illness or injury.
- Paid family leave.
- Paid time off.
- Paid holidays.
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What This Job Offers
Job Type
Full-time
Career Level
Entry Level
