HBM PYE Product Development Failure Analysis Engineer

Micron•Boise, ID

About The Position

Micron Technology is hiring an HBM Product Yield Enhancement Product Development Failure Analysis Engineer in Boise, Idaho. The role is part of the HBM Product Development Failure Analysis team, which brings next-generation HBM products from design through qualification and into high-volume manufacturing. The team works to ensure product reliability, accelerate time-to-market, and enable production ramp by identifying and resolving component-level failures during new product introduction. The engineer will apply electrical, physical, and statistical failure analysis techniques to characterize failures, determine root causes, and drive corrective actions. The role involves analyzing component- and system-level data, applying statistical and AI-enabled tools, and collaborating with Product, Process, Test, Quality, and Manufacturing Engineering teams to improve failure detection, yield, reliability, and product performance. The position may be suitable for an entry-level candidate with a master's degree or equivalent experience, or for candidates at Senior or Staff level.

Requirements

Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field.
At least 2 years of experience performing electrical and statistical failure analysis to identify and understand failure mechanisms.
At least 2 years of experience applying electrical and physical characterization techniques for semiconductor failure analysis.
Analytical and problem-solving skills, including experience applying statistical methods and tools to data analysis.
Experience using AI, machine learning, or data analytics tools to support engineering analysis and root-cause investigations.
Coursework, training, or practical experience in one or more of the following: VLSI, semiconductor device physics, semiconductor processing, Python programming, or statistics.
Strong written and verbal communication skills and the ability to collaborate effectively in multidisciplinary engineering teams.

Nice To Haves

At least 7 years of experience performing electrical and statistical failure analysis in the semiconductor industry.
At least 7 years of experience applying electrical and physical characterization techniques for semiconductor device and component analysis.
Advanced coursework or hands-on experience in VLSI design, semiconductor processes, device physics, Python, and applied statistics.
Experience using AI or Generative AI tools, such as Copilot or Claude, for large-scale data analysis, failure prediction, and root-cause identification.
Experience using statistical analysis software such as JMP.
Ability to influence technical outcomes and drive issue resolution in a multidisciplinary engineering environment.
Ability to communicate complex technical findings to diverse team members and lead multidisciplinary collaboration efforts.

Responsibilities

Perform electrical, physical, and statistical failure analysis to identify, characterize, and understand defect and failure mechanisms in HBM products.
Analyze component- and system-level data to determine failure root causes using statistical techniques, engineering methodologies, and AI-enabled tools.
Apply AI tools such as Copilot and Claude, along with improved analytics, to enhance failure detection, reliability learning cycles, yield improvement, and component performance.
Work with Product, Process, Test, Quality, and Manufacturing Engineering teams to resolve fabrication-, assembly-, and test-related issues.
Identify process defects, assembly-related failures, and test-flow marginalities through detailed data analysis and characterization.
Communicate technical findings, recommendations, and corrective actions, and drive issue resolution across multidisciplinary teams.
Support rapid production ramp, product qualification, and continuous reliability improvement initiatives.