Senior Product Failure Analysis Engineer

Intel Corporation•Hillsboro, OR
•$140,830 - $198,820•Hybrid

About The Position

Intel Foundry is seeking a Senior Product Failure Analysis Engineer to lead complex failure investigations that advance product quality, manufacturing excellence, and technology development across advanced semiconductor technologies. The role applies expertise in semiconductor devices, electrical characterization, physical failure analysis, and root cause investigation to identify and resolve product and process issues. The engineer partners with engineering, manufacturing, yield, process integration, quality, reliability, and design teams to develop corrective actions and improve technology robustness. The role also contributes to future technology development and Intel Foundry’s delivery of semiconductor solutions. This position is based in Hillsboro, Oregon, and is eligible for Intel’s hybrid work model, splitting time between the assigned Intel site and off-site. It is an experienced hire role on Shift 1.

Requirements

  • Master's degree in Physics, Electrical Engineering, or a related field with at least 3 years of experience, or a Ph.D. in the same field with at least 1 year of experience.
  • Experience in semiconductor device physics.
  • Hands-on experience in physical failure analysis.
  • Experience with defect detection or fault isolation methodologies in manufacturing environments.
  • Strong analytical thinking and structured problem-solving skills.
  • Effective communication skills, including translating complex technical findings into actionable recommendations.
  • Ability to collaborate across global, cross-functional teams and influence without direct authority.

Nice To Haves

  • Experience in digital or analog circuit design and validation.
  • Interest in and encouragement of AI tool use to drive efficiency projects and increase failure analysis output in support of Intel Foundry high-volume manufacturing goals.
  • Previous related work experience in a semiconductor foundry.

Responsibilities

  • Lead complex failure analysis investigations involving semiconductor devices, integrated circuits, packages, and manufacturing processes.
  • Develop and execute failure analysis strategies using electrical, physical, material, and structural characterization techniques.
  • Perform root cause analysis of yield, reliability, performance, and customer-return failures.
  • Use fault isolation and failure localization methodologies to identify defect mechanisms and process interactions.
  • Drive corrective and preventive actions in collaboration with manufacturing, process engineering, design, product engineering, quality, and reliability organizations.
  • Define and implement methodologies, tools, and workflows to improve failure analysis effectiveness and throughput.
  • Provide technical leadership during technology transfers, manufacturing ramps, process qualifications, and new product introductions.
  • Analyze datasets and laboratory findings to identify trends, risks, and opportunities for continuous improvement.
  • Document findings and present technical recommendations to senior engineering and business stakeholders.
  • Mentor junior engineers and contribute to the development of organizational failure analysis expertise.
  • Use data analytics and AI-enabled tools to improve investigation efficiency, knowledge sharing, and decision-making.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
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