Staff Failure Analysis Engineer

Renesas Electronics•Palm Bay, FL

6d•Onsite

About The Position

Renesas Electronics is seeking a Staff Failure Analysis Engineer to join its team in Palm Bay, Florida. The role supports product quality, yield improvement, and customer satisfaction through root cause analysis of a wide variety of semiconductor products. The engineer works with Design, Product Engineering, Quality Assurance, and Foundry Operations teams, using analytical techniques and bench characterization to isolate, identify, and report failure mechanisms.

Requirements

Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field with at least 8 years of related experience; or a Master’s degree with at least 6 years of related experience; or a PhD with at least 3 years of related experience.
Strong fundamental understanding of front-end semiconductor fabrication processes, including CMOS, BCD, or analog/mixed-signal, and modern IC packaging technologies.
Demonstrated proficiency using standard bench test equipment, including oscilloscopes, SMUs, power supplies, and multimeters, to power up devices and characterize electrical fault symptoms.
Ability to read and interpret electrical circuit schematics, netlists, and physical layouts, such as Cadence Virtuoso or GDS viewers, to trace electrical paths to physical silicon coordinates.
Hands-on experience with traditional failure analysis workflows, including curve tracing, X-ray, Scanning Acoustic Microscopy (SAM), Photon Emission Microscopy (PEM/EMMI), OBIRCh, thermal emission, wet chemistry/decap, mechanical polishing/lapping, and plasma etching.

Nice To Haves

Advanced physical analysis experience using Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDS/EDX), or Focused Ion Beam (FIB).
Experience with analog, power management, or mixed-signal IC architectures.
Familiarity with industry quality standards such as AEC-Q100 and JEDEC, and formal problem-solving methodologies such as 8D and 5 Whys.
Strong communication skills, including the ability to explain complex technical failure mechanisms to engineering teams and non-technical stakeholders.

Responsibilities

Conduct in-depth root cause analysis on semiconductor products.
Use analytical techniques and bench characterization to isolate and identify failure mechanisms.
Report findings on failure mechanisms.
Work closely with Design, Product Engineering, Quality Assurance, and Foundry Operations teams.