Staff Failure Analysis Engineer

Renesas Electronics•Palm Bay, FL

7d•Onsite

About The Position

Renesas Electronics is seeking a Staff Failure Analysis Engineer in Palm Bay, Florida. The role supports product quality, yield improvement, and customer satisfaction by conducting root cause analysis on semiconductor products. The engineer works with Design, Product Engineering, Quality Assurance, and Foundry Operations teams, using analytical techniques and bench characterization to isolate, identify, and report failure mechanisms. The position requires knowledge of semiconductor fabrication and packaging, electrical bench testing, and interpretation of schematics, netlists, and physical layouts to trace electrical paths to silicon coordinates. It also involves hands-on failure analysis across package and non-destructive testing, image-based fault isolation, and deprocessing workflows. Renesas describes itself as an embedded semiconductor solution provider with more than 21,000 engineers and problem solvers across more than 30 countries. Its culture is grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. The company offers a competitive benefits package, with details provided during the hiring process. The position is not available for remote work. Renesas is an equal opportunity and affirmative action employer. The role may involve technology subject to U.S. export controls.

Requirements

Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field with a minimum of 8 years of related experience; or a Master’s degree with 6 years of related experience; or a PhD with 3 years of related experience.
Strong fundamental understanding of front-end semiconductor fabrication processes, including CMOS, BCD, or analog/mixed-signal, and modern IC packaging technologies.
Demonstrated proficiency using standard bench test equipment, including oscilloscopes, SMUs, power supplies, and multimeters, to power up devices and characterize electrical fault symptoms.
Ability to read and interpret electrical circuit schematics, netlists, and physical layouts, such as Cadence Virtuoso or GDS viewers, to trace electrical paths to physical silicon coordinates.
Hands-on experience with curve tracing, X-ray, and Scanning Acoustic Microscopy (SAM).
Hands-on experience with Photon Emission Microscopy (PEM/EMMI), OBIRCh, and thermal emission.
Hands-on experience with wet chemistry/decap, mechanical polishing/lapping, and plasma etching.

Nice To Haves

Advanced physical analysis experience using Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDS/EDX), or Focused Ion Beam (FIB).
Experience with analog, power management, or mixed-signal IC architectures.
Familiarity with industry quality standards such as AEC-Q100 and JEDEC, and formal problem-solving methodologies such as 8D and 5 Whys.
Strong communication skills, including the ability to explain complex technical failure mechanisms to engineering teams and non-technical stakeholders.

Responsibilities

Conduct in-depth root cause analysis on a wide variety of semiconductor products.
Apply analytical techniques and bench characterization to isolate, identify, and report failure mechanisms.
Collaborate with Design, Product Engineering, Quality Assurance, and Foundry Operations teams.
Power up devices and characterize electrical fault symptoms using bench test equipment.
Interpret schematics, netlists, and physical layouts to trace electrical paths to physical silicon coordinates.
Perform failure analysis using package and non-destructive methods, image-based fault isolation, and deprocessing techniques.