Technology Development Foundry Engineering – Staff Engineer

Intel•Hillsboro, OR

9d•Hybrid

About The Position

As the world's largest chip manufacturer and a global leader in innovation and advanced technology, Intel strives to make every aspect of semiconductor manufacturing state of the art, from process development and manufacturing to yield improvement, packaging, final test, optimization, and world-class supply chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth. We are constantly working to create a more connected and intelligent future, and we need your help. Change tomorrow. Start today. Join the Logic Technology Development (LTD) organization, a powerhouse of process technology innovation driving Intel's IDM 2.0 strategy and enabling the success of our global foundry customers. We are seeking a versatile Staff Engineer to be at the forefront of Intel's foundry transformation, serving as a pivotal technical partner who guides customers through the entire product development lifecycle. In this role, you will leverage multidisciplinary expertise spanning product/process integration, device engineering, and yield engineering to lead customers from pre-silicon evaluation and design tape-out through testing, validation, silicon qualification, and production ramp. This is a unique opportunity to apply broad technical leadership, solve complex challenges, face customers, and actively shape the future of the semiconductor industry in the AI era.

Requirements

Master's degree (with 3+ years of relevant industry experience) or PhD (with 1+ years of relevant industry experience) in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related engineering or physical science discipline.
1+ years of experience in at least one of the following areas: Product/Process Integration engineering, Device engineering, Yield engineering

Nice To Haves

Direct experience with Gate-All-Around (GAA) technology nodes.
Foundry customer engagement experience with a demonstrated customer-focused mindset.
Experience supporting or collaborating with fabless semiconductor companies during product development.
Strong communication, leadership, and stakeholder management skills.

Responsibilities

Drive end-to-end Multi-Project Wafer (MPW) and New Product Introduction (NPI) execution across the full manufacturing flow, from front-end processing through far backend operations, ensuring quality and on-time delivery.
Serve as the primary customer-facing interface for silicon execution including wafer status, silicon health, technical issues, process changes, and execution alignment.
Own identification and resolution of customer-specific integration challenges.
Drive enablement of customer-specific requirements through effective cross-functional coordination.
Serve as the primary customer interface for device performance, including manufacturing readiness reviews, performance roadmaps and projections, post-silicon characterization, model to hardware correlation, and resolution of customer-specific device issues.
Track device performance targets and process control capability while assessing alignment between silicon results and PDK expectations.
Drive device performance optimization through silicon learning, root-cause analysis, and cross-functional corrective actions to improve product readiness and close performance gaps.
Serve as the primary yield point of contact throughout the product lifecycle, from design tape-out through High Volume Manufacturing (HVM).
Develop predictive yield models to identify parametric and defect-related loss mechanisms and provide yield projections for test chips, shuttle vehicles, and production products.
Lead deep-dive investigations into yield signals and nonconformances, partnering with Process Integration, Device Engineering, and Defect Metrology teams to eliminate systematic yield losses.
Perform root-cause analysis leveraging on state-of-the-art FI/FA.
Establish strong correlations between inline process metrics and end-of-line yield performance to improve process control and production predictability.