Staff Engineer, Semi Packaging Engineering
About The Position
This role is responsible for developing advanced semiconductor packaging solutions across various market segments. Solutions must meet demanding product requirements while balancing reliability, manufacturability, and cost. The Staff Engineer leads packaging design, development, and qualification; provides technical leadership in mechanical and thermal analysis; and performs simulations to assess package and system behavior and reliability risks. The role works closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve technical issues. It also collaborates with OSAT partners, substrate suppliers, material vendors, and quality and reliability teams to address technical and manufacturing challenges, improve yield, and establish qualification plans. The engineer develops and maintains package design guidelines, process specifications, simulation methodologies, and technical documentation.
Requirements
- PhD or Master’s degree in Mechanical Engineering or Electrical Engineering.
- At least 5 years of hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
- Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
- Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
- Hands-on experience with major FEM tools.
- Strong analytical, problem-solving, communication, and collaboration skills.
- Ability to work effectively in cross-functional teams and influence technical decisions across organizations.
Nice To Haves
- ANSYS experience.
- Experience with FloTHERM, Sigrity, or Icepak.
- Experience with Cadence Allegro.
Responsibilities
- Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
- Provide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment.
- Perform mechanical simulations of IC packages and systems using FEM tools to evaluate chip-package interaction, package-board interaction, warpage, stress, and reliability risks.
- Perform component- and system-level thermal simulations for semiconductor packages using commercial simulation tools.
- Work with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
- Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
- Work with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications.
- Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.
Benefits
- Medical coverage.
- Vision coverage.
- Dental coverage.
- 401(k).
- Paid vacation.
- Paid holidays.
- Sick time.
- Discretionary performance-based bonus based on personal and company factors.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
