Staff Engineer, Semi Packaging Engineering

Analog Devices•San Jose, CA

About The Position

Analog Devices is seeking an experienced Packaging Engineer to lead development and production implementation of advanced packaging solutions for module products. The engineer owns package development from concept, design, and development through qualification and production release, working with product design teams, material suppliers, manufacturing partners, and outsourced semiconductor assembly and test providers to deliver reliable, manufacturable, high-performance solutions. The role includes developing packaging technologies, materials, assembly processes, process controls, design rules, package models, drawings, and documentation. It also involves package-level and system-level thermal and mechanical simulation, package reliability and failure analysis, process improvement, and cross-functional support. The position requires periodic late-afternoon or early-evening meetings with international partners and occasional international travel. The posting states required travel is 10% of the time and identifies the shift as 1st Shift/Days. A master’s degree in a relevant engineering or science discipline and at least five years of relevant industry experience are required; a Ph.D. is preferred. The expected wage range for a new hire is $130,168 to $188,490. The position qualifies for a discretionary performance-based bonus and includes medical, vision, and dental coverage, a 401(k), paid vacation, holidays, sick time, and other benefits.

Requirements

Master’s degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, Mechanical Engineering, or a related field.
At least five years of relevant industry experience.
Knowledge and experience with package technologies, process flows, materials, chip-package interaction, qualification, and manufacturing implementation.
Experience with surface-mount technology processes, package substrates, printed circuit board technologies, System-in-Package integration, wire-bond and flip-chip interconnects, passive-component integration, and flip-chip bumping.
Strong knowledge of IC package reliability standards and requirements, failure analysis techniques, assembly-process failure mechanisms, and root-cause analysis techniques.
Experience selecting IC package bills of materials, supported by understanding of the mechanical, thermal, and electrical properties of semiconductors, metals, ceramics, and polymer composites.
Experience creating package design models and drawings for package development, simulation, and documentation.
Working experience with manufacturing control plans, FMEA, PCN, statistical process control (SPC), and DOE.
Experience using project-management tools to plan schedules, track milestones, manage risks, and coordinate cross-functional deliverables.
Proficiency in package-level and system-level thermal and mechanical simulation using FloTHERM, ANSYS Icepak, ANSYS Mechanical, or comparable tools.
Ability to participate in periodic late-afternoon or early-evening meetings with international partners and occasional international travel.

Nice To Haves

Ph.D. degree.

Responsibilities

Develop packaging solutions for new module products, optimizing performance, manufacturability, and reliability from initial design through qualification and production release.
Develop materials, assembly processes, and process control plans with material suppliers and assembly vendors during new package development.
Develop package technologies, assembly processes, and design rules in collaboration with product design engineers and suppliers.
Develop project plans and drive on-time delivery of package-development milestones.
Partner with design teams to define package requirements and influence package-related design decisions.
Work with overseas assembly subcontractors on new package development and other package-related engineering activities.
Provide package-related engineering support in collaboration with reliability teams, business units, and supply chain management teams.
Conduct process failure mode and effects analysis (FMEA), execute design of experiments (DOE), and manage process change notification (PCN).
Develop, improve, and maintain package design rules and implement them in design tools and module assembly specifications.
Create and maintain package models, drawings, and design documentation.
Perform package-level and system-level thermal and mechanical simulation for package design optimization and customer support.