Micron Technology's Heterogeneous Integration Group (HIG) is at the forefront of developing advanced memory solutions for AI and accelerated computing. The team specializes in High Bandwidth Memory (HBM) products, targeting AI/ML, high-performance computing (HPC), and data-centric systems. As an HBM Memory Design Engineer – Sustaining (Staff), you will play a crucial role in analyzing and resolving silicon issues across HBM products by collaborating with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD). You will also work with architecture teams to understand specification requirements and contribute to design updates, supporting both silicon release and ongoing product lifecycle needs. This role demands strong AI-driven technical execution and the ability to independently resolve complex issues.
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Job Type
Full-time
Career Level
Senior