Staff Design Engineer, HBM Architecture

Micron • Richardson, TX

3d • Onsite

About The Position

The HBM Architecture team develops advanced datapath solutions that enable industry‑leading bandwidth, power efficiency, reliability, and scalability for Micron’s next‑generation High Bandwidth Memory (HBM) products. The team collaborates closely across design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and core‑die architectures from concept through production. We are seeking a highly motivated HBM Datapath Architect to architect, design, and optimize high‑speed data paths for next‑generation High Bandwidth Memory (HBM) products! This role focuses on logic‑die and core‑die datapath circuitry, enabling industry‑leading bandwidth, power efficiency, reliability, and scalability across JEDEC and custom HBM solutions. The ideal candidate will work closely with design, PHY, ECC, verification, layout, and system teams to deliver robust datapath designs from concept through silicon bring‑up and production.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 7+ years of relevant industry experience, or a Master’s degree with 5+ years of relevant industry experience.
• 3 + years of experience in high‑speed digital datapath design (memory, SerDes, or SoC datapath).
• 3+ years of hands‑on experience with digital schematic build, RTL, or mixed‑signal datapath implementations.

Nice To Haves

• Strong understanding of HBM/DRAM architectures, including read/write data flow, timing, and multi‑channel operation.
• Working knowledge of layout and floorplanning considerations for high‑speed datapath.
• Experience with static timing analysis (STA) and timing‑closure methodologies.
• Familiarity with advanced process‑node challenges related to signal integrity, skew control, and power optimization.

Responsibilities

• Architect and design HBM read and write datapath across core and logic die, including alignment, buffering, timing, and control logic
• Develop high‑speed, low‑latency datapath circuits supporting multi‑channel HBM architectures and wide internal buses
• Optimize datapath designs for bandwidth, power, area, and timing closure at advanced technology nodes
• Design and integrate data reliability features, including parity, ECC hooks, lane redundancy, and remapping mechanisms
• Collaborate with multi-functional teams to translate specifications into robust micro‑architectures
• Collaborate with PHY, DFT, verification, and layout teams to ensure accurate functionality, testability, and manufacturability
• Drive schematic‑level and RTL‑level datapath implementations, including clocking, gating, and reset strategies
• Contribute to design reviews, documentation, and technical mentoring across HBM programs
• Demonstrate proficiency in using AI-enabled tools (e.g., Microsoft Copilot and other approved AI solutions) to improve productivity, streamline workflows, analyze information, and accelerate problem solving.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior