The Boeing Company is hiring an Associate (Level 2) Space Electronics Packaging and Mechanical Product Design and Analysis Engineer for its Boeing Defense, Space and Security Space, Intelligence & Weapons Systems division. The position is on the Electronics Packaging and Mechanical Product Design Team in El Segundo, California, and is expected to be 100% onsite. The team performs in-house work across the product lifecycle, including design concepts, prototyping, and production, with work spanning mechanical PCB design, electronics packaging, and thermal, structural, and vibration analysis. Projects may involve satellite missions, multichip modules, microelectronics, and electronic systems. The role offers collaboration with satellite engineers and access to an onsite satellite factory. The engineer works under general direction to develop and validate mechanical and electronics packaging designs, perform structural and thermal analysis, support PCB layout and routing, and contribute to process improvement and product development. The position requires a bachelor's degree in a directly related field, at least two years of experience using CAD tools, and relevant experience in electronics packaging, PCB/PCBA design and assembly, or thermal, structural, dynamics, or vibration analysis. The candidate must be able to obtain a U.S. security clearance; a post-start U.S. Top Secret/SCI clearance is required. U.S. export-control compliance requirements also apply.
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Job Type
Full-time
Career Level
Entry Level