SMTS - 3D Heterogenous integration Engineer - 2.5D interposer/bridge/DTC
About The Position
GlobalFoundries Advanced Packaging Lab is seeking an accomplished engineer with extensive expertise in chiplet-based system integration, particularly 2.5D interposer/bridge and 3D heterogeneous integration technologies. This senior technical position is responsible for end-to-end integration of advanced heterogeneous solutions, including silicon, glass, and mold interposers and embedded silicon bridge architectures. The role leads integration strategy and readiness for advanced packaging technology platforms, works with internal cross-functional teams and external partners, drives process integration and early product prototyping, and owns integration risk assessment and reliability strategy. The engineer also advances technical innovation through patents, internal publications, and robust integration methodologies. Travel is up to 10%.
Requirements
- Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related field from an accredited degree program.
- At least 10 years of prior related work experience with a master’s degree.
- In-depth knowledge of BEOL processes and advanced packaging integration, including RDL/UBM metallization, wafer thinning and backside processing, wafer test/probe, OSAT collaboration, and package development and assembly.
- Strong problem-solving and technical troubleshooting skills, including expertise in design of experiments, statistical analysis, and yield/reliability learning.
- Demonstrated technical leadership, strong execution, and ability to influence across fab, design, product engineering, reliability, and external partner functions.
- English fluency, written and verbal.
- Ability to travel up to 10%.
Nice To Haves
- PhD education level, with at least 8 years of prior related work experience.
- Demonstrated prior leadership experience in the workplace, school projects, competitions, or similar settings.
- Project management skills, including the ability to innovate and execute solutions and navigate ambiguity.
- Strong written and verbal communication skills.
- Strong planning and organizational skills.
Responsibilities
- Lead integration strategy and readiness for 2.5D/3D advanced packaging technology platforms, including silicon, glass, and mold interposers, silicon bridges, and deep trench capacitors; define interface requirements and co-optimize with fabrication and assembly constraints.
- Partner with unit process, modeling, and manufacturing engineers, as well as tool and material vendors for GlobalFoundries fabs.
- Collaborate on joint development projects with partners to develop 2.5D/3D heterogeneous integration processes and provide timely updates on schedules and deliverables.
- Drive end-to-end process integration, interpret results, and plan work to enable new capabilities and early product prototyping across multiple programs.
- Own integration risk assessment and develop reliability strategy; lead root-cause investigations of failure modes through failure analysis and structured design of experiments.
- Promote technical innovation through patents, internal publications, and robust integration methodologies for 2.5D/3D heterogeneous integration, including interposers, silicon bridges, advanced interconnects, integration control, and metrology.
- Perform work safely and support Environmental, Health, Safety & Security requirements and programs.
- Participate in hiring activities.
- Mentor and guide new hires.
- Perform other duties as assigned by the manager.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
