SMTS - 3D Heterogenous integration Engineer - 2.5D interposer/bridge/DTC
About The Position
GlobalFoundries Advanced Packaging Lab is seeking an accomplished engineer with expertise in chiplet-based system integration, particularly 2.5D interposer/bridge and 3D heterogeneous integration technologies. This senior technical position is responsible for end-to-end integration of advanced heterogeneous solutions, encompassing silicon, glass, and mold interposers as well as embedded silicon bridge architectures. The engineer leads integration strategy and readiness for advanced packaging technology platforms, partners with cross-functional teams and vendors, and collaborates with partners on joint development projects. The role drives process integration, interpretation of results, planning for new capabilities and early product prototyping, integration risk assessment, reliability strategy, and root-cause investigation. It also promotes technical innovation through patents, internal publications, and robust integration methodologies. The role requires a master's degree in a relevant engineering or scientific field and at least 10 years of related experience. A PhD and at least 8 years of related experience are preferred. Travel is up to 10%.
Requirements
- Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related field from an accredited degree program.
- At least 10 years of prior related work experience with a master's degree.
- In-depth knowledge of BEOL processes and advanced packaging integration, including RDL/UBM metallization, wafer thinning and backside processing, wafer test/probe, OSAT collaboration, and package development and assembly.
- Strong problem-solving and technical troubleshooting skills, including expertise in design of experiments, statistical analysis, and yield/reliability learning.
- Demonstrated technical leadership, strong execution, and ability to influence across fab, design, product engineering, reliability, and external partner functions.
- Fluency in written and spoken English.
- Willingness to travel up to 10%.
Nice To Haves
- PhD education level, with at least 8 years of prior related work experience.
- Demonstrated prior leadership experience in the workplace, school projects, competitions, or similar settings.
- Project management skills, including the ability to innovate, execute on meaningful solutions, and navigate ambiguity.
- Strong written and verbal communication skills.
- Strong planning and organizational skills.
Responsibilities
- Lead integration strategy and readiness for 2.5D/3D advanced packaging platforms, including silicon, glass, and mold interposers, silicon bridges, and deep trench capacitors.
- Define interface requirements and co-optimize solutions with fabrication and assembly constraints.
- Partner with unit process, modeling, and manufacturing engineers, as well as tool and material vendors for GlobalFoundries fabs.
- Collaborate with partners on joint development of 2.5D/3D heterogeneous integration processes and provide timely updates on schedules and deliverables.
- Drive end-to-end process integration, interpret results, and plan to enable new capabilities and early product prototyping across multiple programs.
- Own integration risk assessment and develop reliability strategies.
- Drive root-cause investigations of failure modes through failure analysis and structured design of experiments.
- Promote technical innovation through patents, internal publications, and robust integration methodologies for heterogeneous integration.
- Perform work safely and support Environmental, Health, Safety & Security requirements and programs.
- Participate in hiring activities.
- Mentor and guide new hires as they assume their roles and responsibilities.
- Perform other duties as assigned by the manager.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
