Silicon Photonics Advanced Packaging Intern (Summer 2027)
About The Position
GlobalFoundries is seeking a Summer 2027 intern to support development of electro-optical transceivers using its Photonix platform and advanced 2.5D and 3D co-packaged optics form factors. This hands-on role contributes to thermal, mechanical, electrical, and optical chip-package co-design, with a focus on module performance, reliability, packaging design, materials selection, and advanced chiplet integration requirements. The internship program offers one-on-one mentorship, growth-focused work assignments, professional development opportunities, and networking with executives. Interns and co-ops are part of GlobalFoundries’ entry-level talent pipeline and gain experience intended to prepare them for careers in the semiconductor industry.
Requirements
- Actively pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or a related field through an accredited degree program during the internship.
- At least a 3.0 overall GPA and good academic standing.
- English fluency, written and verbal.
- Ability to work at least 40 hours per week during the internship.
Nice To Haves
- Prior related internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics.
- Demonstrated leadership experience through academic projects, student organizations, competitions, or prior employment.
- Strong interest in using AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
- Project management skills and ability to innovate and execute solutions in ambiguous environments.
- Strong written and verbal communication skills.
- Strong planning and organizational skills.
- Exposure to thermal, mechanical, electrical, optical, or multiphysics simulation tools.
- Knowledge of semiconductor packaging, chiplets, silicon photonics, or co-packaged optics.
Responsibilities
- Support Silicon Photonics advanced packaging innovation and customer design enablement by contributing to packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT ecosystem partners.
- Participate in cross-functional design reviews and use engineering analysis to help resolve technical, manufacturability, reliability, and yield concerns for new customer products.
- Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality, and document findings and recommendations for engineering stakeholders.
- Contribute to qualification robustness and continuous improvement plans by applying consistent design processes, tracking requirements, and supporting product development from concept through production readiness.
- Perform activities safely and responsibly and support Environmental, Health, Safety & Security requirements and programs.
Benefits
- One-on-one mentorship
- Professional development opportunities
- Opportunity to network with executives
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What This Job Offers
Job Type
Full-time
Career Level
Intern
