Signal Integrity Engineer – Memory Interface
About The Position
Work with the team developing SoCs used in Apple mobile devices, with responsibility for memory-interface signal integrity across the package-to-board span. The role covers electrical and physical design of memory systems, signal and power integrity modeling, simulation, characterization, and validation. Conduct end-to-end SI and PI simulation studies of memory systems, including channel and power-delivery-network modeling across die, interposer, package, PCB, and PMU, to meet timing and voltage specifications. Provide feedback and guidelines to silicon floorplanning, package, system design, and other cross-functional teams, including optimal I/O settings and design guidance. Study the feasibility of next-generation signaling schemes and correlate simulation results with silicon measurements.
Requirements
- Bachelor’s degree minimum; MSEE with at least 5 years of industry experience, and/or a Ph.D. (as stated in the posting).
- Familiarity with signal and power integrity issues in memory interfaces.
- Strong fundamentals in 2D/3D electromagnetic simulation tools and transmission-line theory.
- Proficiency in Python and strong foundational coding skills.
- Expertise in using generative AI coding assistants to enhance productivity.
- Excellent academic background.
Nice To Haves
- Prior experience with actual product package and board design and analysis.
- Prior experience developing PI/SI methodologies.
- Prior experience with laboratory correlation and validation of simulation results.
- Familiarity with laboratory equipment such as VNA, TDR, real-time oscilloscope, and spectrum analyzer.
Responsibilities
- Perform electrical extraction and validation of packages and MLBs.
- Work with circuit and controller teams to optimize memory-system design.
- Model, simulate, and characterize signal and power integrity for memory interfaces.
- Develop and execute test plans to validate signal and power integrity.
- Work with product engineering and system engineering to debug products and improve yield.
- Conduct end-to-end SI and PI simulation studies of memory systems, including channel and power-delivery-network modeling across die, interposer, package, PCB, and PMU.
- Provide feedback and design guidelines to silicon floorplanning, package, system design, and other cross-functional teams.
- Provide optimal I/O settings and design guidelines to cross-functional teams.
- Perform feasibility studies for next-generation signaling schemes.
- Correlate simulation results with silicon measurements.
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What This Job Offers
Job Type
Full-time
