Senior SiPh Product Development Engineer

Intel Corporation•Santa Clara, CA

1d•$164,470 - $232,190•Hybrid

About The Position

Intel's Integrated Photonics Solutions (IPS) organization is driving the future of high-performance computing and networking through the development of advanced optical interconnect technologies built on Intel's silicon photonics platform. This position will lead the development and industrialization of next-generation silicon photonics and high-speed optical products from concept through high-volume manufacturing. The role requires driving technical execution, manufacturing readiness, and cross-functional decision-making to deliver products that meet performance, quality, cost, and schedule objectives.

Requirements

BS in Physics, Electrical Engineering, Optical Engineering, or a related discipline with 6+ years of relevant industry experience, or a Master's degree with 4+ years of relevant industry experience.
3+ years of experience in one or more of the following: High-speed optical component or product development, Silicon photonics development, Semiconductor fabrication process development, Wafer-level assembly or packaging development, Test development and validation.

Nice To Haves

Experience in silicon photonics, optical transceivers, or semiconductor product development, plus 2 or more of the following skills: 3+ years of semiconductor fab process experience, 3+ years of assembly, packaging, or manufacturing process experience, Proven track record of leading cross-functional engineering teams and successfully transitioning products from development to high-volume manufacturing.

Responsibilities

Lead matrixed teams across design, fab, assembly, test, quality, and operations to define and execute the product Plan of Record (POR).
Drive end-to-end development of Photonic ICs (PICs), Electronic ICs (EICs), and manufacturing process technologies from concept through production ramp.
Balance technical tradeoffs, business priorities, cost, schedule, and risk to enable informed decision-making and successful product execution.
Identify and mitigate technical and execution risks through contingency planning and cross-functional alignment.
Drive manufacturing readiness, including wafer-start planning, qualification strategy, capacity analysis, customer sampling, and assembly/test site certification.
Serve as the primary interface to stakeholders and leadership, providing clear communication of product status, risks, and recommendations.
Build strong partnerships across organizations to accelerate execution and deliver business results.
Interface with fab, optical design, hardware, firmware, IC design, test, operations, and quality teams to ensure successful product development and manufacturing ramp.