Senior Engineer, Advanced Packaging — Fail-Mode Metric Reaction (FMR)

Micron Technology•Boise, ID

24d

About The Position

Micron Technology is seeking an experienced Fail-Mode Metric Reaction (FMR) Engineer to drive yield analysis, failure-mode characterization, and understanding of failure mechanisms across test vehicles and advanced packaging products. The role owns the reaction loop between defect signatures observed in manufacturing and corrective actions taken with process, build, and reliability partners. It covers time-zero defects, internal reliability failures, and customer RMA returns. The engineer analyzes yield and defect signatures, investigates and root-causes failure mechanisms, and drives containment, corrective, and preventive actions. The role works closely with APTD Process teams, APTD FA labs, PSE, and TSE teams. It also develops scalable data pipelines, dashboards, and automated workflows, applies AI/ML methods to engineering analysis, and presents findings and reaction plans to leadership across functions.

Requirements

MS, PhD, or equivalent experience in Electrical Engineering, Materials Science, Physics, or a closely aligned field.
3–5 years of relevant industry experience in advanced packaging, failure analysis, yield engineering, or a closely related semiconductor field.
Hands-on experience with advanced packaging fail modes, such as bump/interconnect, TSV, RDL, underfill, warpage, delamination, or EM/TDDB-related package failures.
Strong data analysis skills using Python, SQL, JMP, or equivalent tools to analyze high-volume manufacturing or test data.
Experience applying AI/ML and automation techniques to improve engineering workflows.
Proven experience driving FA-to-fix loops with process and product teams.

Nice To Haves

Familiarity with testing methodologies related to package fail modes.
Familiarity with reliability stress methodologies such as HTOL, TC, and uHAST, and their failure signatures.

Responsibilities

Analyze yield for advanced packaging test vehicles and production products, breaking down defect signatures by fail mode, location, layer, and process step.
Investigate and root-cause time-zero fail modes and mechanisms, correlating electrical signatures with physical failure analysis findings.
Drive reaction plans for internal reliability failures and customer RMAs, translating failure-mechanism understanding into containment, corrective, and preventive actions.
Partner with APTD Process teams on process-excursion triage and corrective action.
Partner with APTD FA labs on physical failure-analysis planning, sample prioritization, and interpretation.
Work with PSE and TSE teams on test coverage, screen enhancement, and product-level dispositioning.
Build and maintain data analysis pipelines, dashboards, and automated workflows to scale FMR response and shorten time-to-signature.
Apply AI/ML techniques for signature classification, anomaly detection, and workflow automation.
Present findings and reaction plans to leadership across multiple functions.