Senior Electronics Repair Engineer- Tampa, FL

Military Spouse Corporate Career Network•Tampa, FL

6d•Onsite

About The Position

Reporting to the Senior Vice President, Parts Operations, this role serves as the organization's technical authority for component-level electronics repair, reverse engineering, failure analysis, and repair methodology development. The successful candidate will possess expert-level expertise in component-level troubleshooting, multilayer PCB repair, advanced surface-mount rework, BGA/FPGA replacement, and the development of innovative repair solutions where OEM documentation is unavailable. Working collaboratively with Operations, Technical Support, and Field Service, the Senior Electronics Repair Engineer develops standardized repair methodologies and engineering solutions that improve repair quality, increase first-pass yield, reduce replacement costs, expand Probo Medical's advanced repair capabilities, and extend the operational life of critical medical imaging equipment supporting healthcare providers worldwide.

Requirements

High School Diploma/GED, or equivalent from two-year university or technical school; or a minimum of 5 years of related experience to the work activities or equivalent combination of education and experience.
Exceptional analytical, troubleshooting, and engineering problem-solving abilities with the technical judgment to independently resolve highly complex electronic failures.
Meticulous attention to detail and an uncompromising commitment to quality, reliability, and engineering excellence.
Excellent technical communication and documentation skills with the ability to effectively communicate complex engineering concepts across cross-functional teams.
Demonstrated innovation and creativity in developing new repair methodologies, solving unsupported electronic failures, and driving continuous improvement.
Strong technical leadership with the ability to mentor engineers and technicians while serving as a trusted subject matter expert in advanced electronics repair.

Nice To Haves

Degree in Electronics or related engineering field preferred.
Extensive experience in advanced component-level repair of complex multilayer printed circuit board assemblies (PCBAs).
Experience diagnosing and repairing high-density analog, digital, mixed-signal, RF, embedded, and power electronic assemblies utilizing advanced troubleshooting, BGA/FPGA rework, multilayer PCB restoration, reverse engineering, and engineering-level failure analysis.
Experience supporting diagnostic medical imaging, aerospace, defense, semiconductor manufacturing equipment, industrial automation, or other high-reliability electronic systems.
Working knowledge of IPC-7095 – Design and Assembly Process Implementation for Ball Grid Arrays (BGAs), including BGA assembly, inspection, thermal profiling, re-balling, and advanced FPGA/BGA rework best practices
IPC-A-610 – Acceptability of Electronic Assemblies
IPC J-STD-001 – Requirements for Soldered Electrical and Electronic Assemblies
IPC-7711/7721 – Rework, Repair and Modification of Electronic Assemblies
ANSI/ESD S20.20 Electrostatic Discharge Control

Responsibilities

Diagnose, troubleshoot, and repair complex multilayer PCB assemblies to the component level utilizing advanced engineering diagnostic techniques.
Perform precision surface mount rework, BGA/FPGA replacement, thermal profile development, and advanced PCB restoration including trace, pad, via, and multilayer interconnect reconstruction.
Perform advanced troubleshooting of analog, digital, mixed-signal, RF, embedded, and power electronic circuits utilizing oscilloscopes, logic analyzers, X-ray inspection systems, and other engineering diagnostic equipment.
Reverse engineer electronic assemblies and develop validated repair methodologies, engineering work instructions, electrical test procedures, and technical documentation where OEM documentation is unavailable.
Perform engineering-level failure analysis, identify recurring failure modes, and implement corrective actions that improve repair quality, reliability, and first-pass yield.
Execute precision rework of fine-pitch surface-mount components, including QFP, QFN, CSP, BGA, and FPGA devices, utilizing advanced rework systems such as the Ersa HR600 XL and Ersa IR/PL650A.
Remove, reball, replace, and functionally verify FPGA and BGA devices while developing and optimizing thermal profiles for complex multilayer PCB assemblies.
Collaborate with Quality, Operations, Technical Support, Supply Chain, and Field Service to develop new repair capabilities and improve engineering processes.
Ensure compliance with ISO 13485 Quality Management System requirements, ESD standards, and established engineering documentation practices.
Evaluate emerging repair technologies, equipment, and engineering techniques that expand the organization's advanced electronics repair capabilities.