Senior Analog and Mixed Signal Design Engineer

Intel•Hillsboro, OR
•Onsite

About The Position

Intel’s Advanced Design Foundational IP Organization within the Design Technology Platform develops analog/mixed-signal and high-speed I/O IP for Intel process technologies. The High-Speed I/O team develops SerDes and die-to-die interface reference designs and test chips, co-optimizing process technology with wireline standards such as high-speed PAM4 links, PCIe, UCIe, and HBM. This senior individual-contributor role seeks an expert in high-speed SerDes circuit design and system architecture. The engineer will own SerDes link architecture for Intel technology test chips, spanning link budgets and equalization strategies through transistor-level design of critical analog front-end and clocking blocks. The role also translates link requirements into device, interconnect, and design-rule requirements for future process nodes, and provides technical leadership across design, layout, and measurement engineers.

Requirements

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, or Electrical and Computer Engineering and at least 6 years of industry experience in high-speed wireline SerDes circuit design; or a master’s degree in one of these fields and at least 4 years of relevant industry experience; or a Ph.D. in one of these fields and at least 2 years of relevant industry experience.
  • Experience with transistor-level design of SerDes TX, RX, or clocking circuits in at least one silicon-proven design at 28 Gb/s per lane or higher.
  • Experience in at least one of the following: SerDes link architecture, including channel and link-budget analysis or equalization trade-off studies used to set block-level specifications; laboratory validation of high-speed links, including BER, eye, or jitter measurement and simulation correlation; or behavioral or statistical link modeling in MATLAB or Python.

Nice To Haves

  • Experience with silicon-proven designs at 56 Gb/s PAM4 or higher in FinFET or GAA CMOS, and multiple tape-outs with block ownership.
  • Experience across SerDes architecture, laboratory validation, and link modeling.
  • Experience in ADC/DSP-based receivers at 112 Gb/s PAM4 or higher, including time-interleaved ADC design.
  • Experience developing 224 Gb/s-class links, including IEEE 802.3dj or OIF CEI-224G.
  • Experience developing PCIe Gen6/Gen7 PHY or UCIe die-to-die PHY.
  • Design experience on 5nm-class or more advanced nodes and design-technology co-optimization with process teams.
  • Experience in package and channel co-design, including package/PCB channel modeling, signal and power integrity, and crosstalk.
  • First-author publications at ISSCC, VLSI Symposium, CICC, or JSSC, or patents in SerDes circuits or architecture.
  • Technical leadership of a multi-engineer SerDes design team through full PHY delivery.

Responsibilities

  • Define SerDes link architecture for next-generation interfaces, including channel analysis, link budgets, jitter and noise budgets, and equalization partitioning across TX FFE, RX CTLE, DFE, and ADC/DSP-based receivers.
  • Build and maintain statistical and time-domain system-level link models in MATLAB or Python, including COM- and IBIS-AMI-based models, and derive block-level specifications for TX, RX, ADC, and clocking circuits.
  • Lead transistor-level design of critical SerDes blocks, including TX drivers with FFE, RX analog front ends, DFE and slicers, time-interleaved ADC front ends, CDR and phase interpolators, PLLs, and clock distribution.
  • Drive test-chip definition, integration, tapeout readiness, and silicon bring-up; compare measured BER, eye, jitter, and power against models and lead root-cause analysis of silicon-to-model gaps.
  • Translate SerDes requirements into process and PDK requirements, including device performance and parasitics, BEOL RC, inductor Q, matching, ESD capacitance budget, reliability, and aging.
  • Drive design-technology co-optimization with process, PDK, and template-library teams.
  • Mentor engineers, lead design reviews, and represent Intel Foundry in technical engagements with IP partners and foundry customers.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health benefits
  • Retirement benefits
  • Vacation
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