Senior Advanced Manufacturing Engineer

General Dynamics Mission Systems, Inc•Bloomington, MN

1d•$111,104 - $123,257•Onsite

About The Position

General Dynamics Mission Systems is seeking an Advanced Manufacturing Engineer for its Bloomington, Minnesota facility. The engineer develops, implements, and maintains methods, operation sequences, and processes for manufacturing or fabricating parts, components, subassemblies, and final assemblies. The role develops manufacturing engineering plans and strategies for specific products and processes, estimates manufacturing costs, determines time standards, and recommends tooling and process requirements for new or existing product lines. The engineer also works to improve manufacturing methods using knowledge of product design, materials and parts, fabrication processes, tooling and production equipment capabilities, assembly methods, and quality-control standards. The position supports Surface Mount Technology manufacturing and electronics assembly materials, process quality, reliability, and manufacturability. Applicants may be subject to a U.S. Government security investigation and must meet eligibility requirements for access to classified information. U.S. citizenship is required due to the nature of the work performed at the facilities.

Requirements

Bachelor’s degree in Manufacturing or Industrial Engineering, a related specialized area or field, or a related Science, Engineering, or Mathematics field, plus at least 5 years of relevant experience; alternatively, a master’s degree plus at least 3 years of relevant experience.
Effectively lead quality initiatives using Six Sigma methodology to determine nonconformance extent, root cause, and corrective action.
Proficient use and understanding of Design for Manufacture (DFM) concepts, principles, and theories.
Proficient understanding of lean techniques and statistical analysis.
Demonstrated experience supporting SMT manufacturing processes, including solder paste printing, component placement, reflow, AOI, inspection, and rework.
Working knowledge of electronics assembly materials, including solder paste, flux, adhesives, epoxies, conformal coatings, underfill, encapsulants, potting compounds, thermal interface materials, and cleaning chemicals.
Ability to review and follow material requirements, technical data sheets, handling instructions, cure profiles, shelf-life controls, and environmental-storage requirements.
Experience selecting, applying, and troubleshooting assembly materials to ensure product quality, reliability, and manufacturability.
Familiarity with ESD requirements, MSL handling, lot traceability, expiration-date management, and bake-out requirements.
Ability to work collaboratively with Manufacturing Engineering, Quality, and Component Engineering to address material-related defects, improve processes, and support new-product introduction.
U.S. citizenship is required; selected applicants may be subject to a U.S. Government security investigation and must meet eligibility requirements for access to classified information.

Nice To Haves

Experience programming, troubleshooting, or supporting equipment from manufacturers such as Mycronic/Mydata, Fuji, ASM/Siplace, Yamaha, Juki, Koh Young, CyberOptics, or Nordson.
Current or prior IPC certification, particularly J-STD-001, IPC-A-610, IPC-7711/7721, or trainer/certified instructor credentials.
Strong understanding of electronics assembly materials and their effects on manufacturing quality and long-term reliability.
Ability to interpret engineering drawings, BOMs, assembly instructions, Gerber/ODB++ data, and component datasheets.
Experience conducting root-cause analysis and implementing corrective actions for defects such as insufficient solder, bridging, tombstoning, voiding, component misalignment, opens, or missing components.
Creative and innovative approach requiring advanced decision-making skills.
Collaborative team player who meets and exceeds personal and team commitments.
Commitment to ongoing professional development and awareness of technology trends.
Ability to identify opportunities to apply AI for continuous improvement and innovation.

Responsibilities

Develop, implement, and maintain manufacturing or fabrication methods, operation sequences, and processes for parts, components, subassemblies, and final assemblies.
Develop manufacturing engineering plans and strategies for specific products and processes.
Estimate manufacturing costs, determine time standards, and recommend tooling and process requirements for new or existing product lines.
Develop and improve manufacturing methods using knowledge of product design, materials, fabrication processes, tooling, production equipment, assembly methods, and quality-control standards.
Lead quality initiatives using Six Sigma methodology to determine the extent of nonconformance, identify root causes, and define corrective actions.
Support Surface Mount Technology manufacturing processes, including solder paste printing, component placement, reflow, AOI, inspection, and rework.
Select, apply, and troubleshoot electronics assembly materials to support product quality, reliability, and manufacturability.
Work with Manufacturing Engineering, Quality, and Component Engineering to resolve material-related defects, improve processes, and support new-product introduction activities.
Review and follow material requirements, technical data sheets, handling instructions, cure profiles, shelf-life controls, and environmental-storage requirements.
Apply material controls including ESD requirements, moisture sensitivity level handling, lot traceability, expiration-date management, and bake-out requirements.
Identify opportunities to apply AI to continuous improvement and innovation.