Quality and Reliability R&D Lab Engineer

Intel•Hillsboro, OR

15h•Onsite

About The Position

At Intel Foundry, our Technology Development and Manufacturing teams power a worldwide network of cutting edge fabs and assembly/test facilities. To keep pace with an aggressive technology roadmap, we are pushing the limits of transistor and interconnect reliability delivering faster time to data and higher quality insights that directly shape Intel's and our foundry customers' most advanced process technologies. Join the Stress Testing and Reliability (STaR) Lab as part of the Foundry Lab Network (FLN), within the broader Foundry Quality, Reliability, and Labs (FQRL) organization. You'll help develop and enable efficient, high-quality reliability testing, with hands-on exposure to reliability characterization of transistors, interconnects, and other devices on today's and tomorrow's technology nodes. This is a highly visible, technically challenging role where your work will directly influence the reliability, performance, and time-to-market of current and future Intel process technologies. You'll be part of a dedicated team advancing the reliability stress capabilities needed to qualify both Intel's internal products and external foundry customers' technologies.

Requirements

A minimum of a Master's degree in Electrical Engineering/Physics/related field with 3+ years of experience on electrical characterization of electronic materials and devices.
3+ years of experience in semiconductor electrical characterization, device testing, and troubleshooting using parametric analyzers, oscilloscopes, and related equipment
Leadership experience in technical organizations
Project management skills
Statistics with practical experience using JMP
Experience applying statistical analysis techniques to experimental data; proficiency with JMP or equivalent
Experience with hardware automation, preferably using LabVIEW, TestStand, or Python
Proven verbal and written communication skills
Team player with proven skills to collaborate and influence in heterogenous team
Proven skills to perform successfully in a fast paced, high pressure team environment

Nice To Haves

PhD in Electrical Engineering, Physics, or a related field
Previous related work experience in a semiconductor foundry preferred
Experience of work and external vendors will be an advantage
Experience leading technical teams, influencing stakeholders, and managing resources and timelines in a matrixed environment
Familiarity with semiconductor device fabrication processes and packaging process flows
Delivering results in time-critical technical projects involving innovation and strategic planning
Problem-solving techniques and fundamental engineering concepts to create novel, efficient solutions

Responsibilities

Drive root cause investigations when issues arise
Lead improvement projects that enhance data integrity, tool performance, automation, and overall lab efficiency
Design, develop, and qualify new tools, test methodologies, and workflows for characterizing device reliability
Work closely with lab operations, industrial engineers, module engineers, and external vendors
Ensure new processes and methods are robustly developed, documented, and smoothly transferred to operations
Design and qualify new reliability stress techniques for transistors, and interconnects
Build next-generation reliability stress infrastructure including hardware, software, procedures, and documentation
Support pathfinding, technology development, and certification milestones for Intel and foundry customers
Model world-class safety, quality, and operational excellence