Product Yield Enhancement (PYE) Engineer

Micron Technology • Boise, ID

7d

About The Position

As a Product Yield Enhancement (PYE) Electrical Failure Analysis (EFA) Engineer at Micron, you will work with a team dedicated to improving yields of next-generation memory products throughout the manufacturing lifecycle. Through failure analysis of test, internal qualification, and RMA failures, you will identify and help eliminate yield-limiting defects to improve product reliability, support rapid production ramps, and enable early time to market.

The role focuses on fault isolation using electrical and physical characterization techniques alongside data analysis to identify physical defects introduced during process fabrication or package assembly. You will present and coordinate failure analysis findings with Management, Product, Process, Assembly, and Global Quality teams and help ensure corrective actions are implemented and yields continue to improve.

Requirements

• Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related technical field.
• At least 2 years of experience in semiconductor failure analysis, yield enhancement, or a closely related field.
• Hands-on experience with fault isolation techniques, including emission microscopy, laser-based methods such as OBIRCH/TIVA, and EOTPR.
• Working knowledge of CMOS fabrication processes and package assembly flows.
• Proficiency in reading and interpreting semiconductor layout and schematic designs.
• Experience with Physical Failure Analysis (PFA) tools and de-processing techniques such as FIB, cross-sectioning, and delayering.
• Ability to perform data extractions and analysis from fab, probe, and backend test systems.
• Strong written and verbal communication skills, including the ability to create clear, organized failure analysis reports.

Nice To Haves

• Master's degree, Ph.D., or equivalent experience in Electrical Engineering, Materials Science, Physics, or a related field.
• More than 4 years dedicated to electrical failure analysis in a high-volume semiconductor manufacturing environment.
• Experience with memory products such as DRAM, NAND, or HBM.
• Advanced proficiency with EFA tools and techniques such as photon emission, laser voltage probing (LVP), and thermal laser stimulation.
• Familiarity with reliability failure modes such as electromigration, TDDB, and HCI, as well as delayed breakdown mechanisms.
• Experience modeling or characterizing complex fail signatures across test insertions.
• Demonstrated ability to collaborate across Process, Product, Assembly, and Quality Engineering teams.
• Experience with data analysis tools or scripting languages such as Python, JMP, or MATLAB for supplemental data extraction and analysis.
• Strong presentation skills and experience communicating technical findings to senior leadership.
• AI proficiency or AI-enabled experience.

Responsibilities

• Perform Electrical Failure Analysis and fault isolation using emission microscopy, laser techniques, EOTPR, and PFA/de-processing methods.
• Characterize and model backend test, internal qualification, and RMA fail signatures using layout, schematic, and data analysis tools.
• Apply knowledge of CMOS fabrication processes and package assembly flows to identify process- and assembly-related defects, root causes, and downstream effects.
• Evaluate reliability concerns and delayed breakdown failure mechanisms across test insertions.
• Extract fab, probe, and backend data to provide supplemental evidence supporting failure analysis conclusions.
• Generate organized and timely failure analysis reports that clearly communicate causes, effects, and recommended actions.
• Present and coordinate findings with Management, Product, Process, Assembly, and Global Quality teams.

Benefits

• Choice of medical, dental, and vision plans.
• Programs to help protect income in the event of illness or injury.
• Paid family leave.
• Paid time off.
• Paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level