New College Grad - Product Yield Enhancement Engineer, HBM

Micron Technology • Boise, ID

1d • Onsite

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, Inc., you will join a team responsible for bringing next-generation High Bandwidth Memory (HBM) products from design through high-volume manufacturing. This role plays a critical part in improving product reliability, accelerating production ramp, and enabling early time-to-market through advanced failure analysis. You will focus on analyzing failures from production test, internal qualification, and customer returns (RMA), using a combination of electrical, physical, and data-driven techniques to identify root causes related to fabrication or assembly processes.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Computer Engineering, Physics, Chemistry, or equivalent practical experience.
• 0-2 years of semiconductor industry experience in yield engineering, fault isolation, or failure analysis.
• Experience with computer-aided design (CAD), including layout and schematic analysis.
• Strong understanding of semiconductor device physics and VLSI design principles.
• Proficiency in scripting within UNIX/Linux environments (e.g., Tcl, Bash, Shell).

Nice To Haves

• Hands-on experience with fault isolation and failure analysis techniques.
• Strong understanding of both physical and logical semiconductor design.
• Knowledge of semiconductor packaging, assembly processes, and fabrication workflows.
• Experience in reliability engineering and quality analysis methodologies.
• Experience using AI-assisted analytics to enhance data interpretation, anomaly detection, and yield improvement initiatives.

Responsibilities

• Perform electrical failure analysis and fault isolation using techniques such as emission microscopy, laser-based methods, and EOTPR.
• Analyze and model failure signatures from backend testing, qualification, and RMA data.
• Apply physical failure analysis (PFA) and de-processing techniques to isolate defects.
• Develop and maintain deep technical knowledge of CMOS/FinFET fabrication processes, device structures, and process integration.
• Generate clear, organized, and timely failure analysis reports, including root cause and corrective action insights.
• Collaborate multi-functionally with Product, Process, Assembly, Quality, and Management teams to communicate findings and drive resolution.
• Apply AI-assisted tools and workflows to analyze large datasets, identify failure patterns, and accelerate root-cause determination.
• Support flexible work schedules, including swing or night shifts as required by business needs.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level