2027 Process Support Engineer, New College Grad - Bachelor's (Multiple Locations))

Applied Materials•Boise, ID

2d•$70,000 - $95,500

About The Position

Applied Materials is hiring a new college graduate Process Support Engineer to help guide advanced semiconductor technology from qualification through production. The role combines hands-on customer support at semiconductor fabrication facilities with collaboration with customers and R&D teams to develop and qualify processes for manufacturing advanced chips. Engineers may work across Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal, Implant, and Metrology Inspection technologies. The position includes on-site installation, diagnosis, service, and repair of complex systems and equipment; designing process experiments; analyzing experimental data using statistics; and reporting conclusions. Engineers also troubleshoot difficult process and product issues, conduct root cause analyses, and communicate with customers and internal stakeholders. The role is part of the Global Field Group, which installs, optimizes, and sustains semiconductor manufacturing equipment at customer sites. New hires begin in the Process Support Engineer Development Program, which provides blended learning, networking, and rotations across Applied Materials sites. Training includes exposure to manufacturing facilities in Texas and R&D centers such as the Maydan Technology Center in California and the Materials Engineering Technology Accelerator in New York. The role can provide a foundation for future opportunities in technical program management, account management, product and technology development, and field service. The position is based in Austin, Texas; Boise, Idaho; or Hillsboro, Oregon. The stated start date is July 26, 2027. Travel is 20% of the time, and relocation is eligible. The listed salary range is $70,000 to $95,500. Candidates may also be eligible for bonus and stock award programs, as applicable.

Requirements

Graduating with a bachelor's or master's degree in Materials Engineering, Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or a related field.
Good academic standing; a GPA of 3.0 or above on a 4.0 scale is preferred.
Strong interpersonal skills, with an emphasis on building trust.
Ability to exercise judgment based on analysis of multiple sources of information.
Ability to explain difficult or sensitive information clearly and work to build consensus.
Creative and analytical problem-solving ability.
Flexible and adaptable mindset.
Ability to thrive in a results-driven culture.

Nice To Haves

A GPA of 3.0 or above on a 4.0 scale is preferred.

Responsibilities

Provide customer support through on-site installations, system diagnoses, and service and repair of complex systems and equipment.
Develop leading-edge semiconductor processes in collaboration with customers and R&D teams.
Design hypothesis experiments and design of experiments (DOE).
Analyze experimental data using statistics and compile reports with high-level conclusions.
Troubleshoot complex problems, perform root cause analyses, and resolve process engineering and customer product issues.
Communicate with internal stakeholders and customers to achieve goals, build relationships, and establish trust.