Process Integration, Yield and Defect Reduction Engineering Lead

Intel Corporation•Rio Rancho, NM

1d•$140,830 - $198,820•Onsite

About The Position

The New Mexico Silicon Manufacturing (NM Si Manufacturing) Integration Team is seeking a highly motivated engineering professional with a strong technical background to grow into a Process Integration (PI) Team Lead role. This position reports directly to the NM Si Manufacturing Integration Director and offers the opportunity to lead teams of technical contributors supporting Intel's advanced packaging manufacturing operations. In this role, you will collaborate closely with Advanced Packaging High-Volume Manufacturing (HVM) engineering and factory operations teams to support the transfer, ramp, and sustainment of advanced packaging technologies. You will play a critical role in ensuring successful execution against foundry customer commitments while driving continuous improvements in yield, quality, reliability, and manufacturing efficiency. The ideal candidate will have a proven track record of technical leadership, innovation, and cross-functional collaboration. Success in this position requires strong problem-solving skills, the ability to influence across organizations, and a passion for enabling technology development in a high-volume manufacturing environment.

Requirements

Bachelor's or Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics, or a related technical field.
5+ years of experience in semiconductor manufacturing or advanced packaging.
5+ years of experience in process integration or defect reduction for backend interconnect or advanced packaging processes.
3+ years of experience applying Design of Experiments (DOE) methodologies.
5+ years of experience in data analysis and statistical process control using tools such as JMP, SQL, PCS, or similar platforms.

Nice To Haves

Strong understanding of semiconductor manufacturing process flow and advanced packaging technologies.
Knowledge of process capability analysis, specification management, statistical variation, and process control methodologies.
Proven ability to analyze defectivity and parametric data to identify yield limiters and drive process improvements.
Experience with yield analysis and defect reduction methodologies.
Experience applying Failure Modes and Effects Analysis (FMEA) techniques.
Experience developing inline monitoring systems, dashboards, and manufacturing health metrics.
Demonstrated success leading technology development, transfer, and manufacturing ramp activities.
Strong project management, communication, and stakeholder management skills.
Ability to lead cross-functional teams and influence technical decisions across multiple organizations.

Responsibilities

Lead teams of technical contributors supporting Intel's advanced packaging manufacturing operations.
Collaborate closely with Advanced Packaging High-Volume Manufacturing (HVM) engineering and factory operations teams to support the transfer, ramp, and sustainment of advanced packaging technologies.
Ensure successful execution against foundry customer commitments.
Drive continuous improvements in yield, quality, reliability, and manufacturing efficiency.
Solve complex technical challenges using innovative and data-driven approaches.
Drive operational excellence, yield improvement, and manufacturing efficiency initiatives.