Process Engineering Intern

Lam Research•Tualatin, OR

1d•Hybrid

About The Position

Be a part of the exciting Sabre 3D process development and engineering team. Our mission is to advance and innovate WFE (wafer fab equipment) electrodeposition process and technology, in the field of advanced packaging, including through Silicon via, through glass via, panel level plating and grain engineering.

Requirements

Highly motivated, high-energy individuals who are eager to learn and contribute to a rapidly growing organization.
Driven to take on complex technical challenges and is passionate about developing and implementing world-class solutions.
Strong analytical and problem-solving skills.
Experience in modeling and simulation.
Solid understanding of grain growth mechanisms.
Hands-on experience in electrochemical plating processes.
Ability to bridge theoretical understanding with practical process development.

Nice To Haves

Hands on experience working in wet laboratory
Experience working on troubleshooting complex equipment and systems
Knowledge in electrochemistry a plus especially in areas of copper, tin and tin-alloys, nickel electrodeposition
Experience with modeling and simulation techniques (e.g., transport phenomena, electrochemical kinetics, or microstructural evolution) to support process understanding and optimization
Solid understanding of grain growth mechanisms, microstructure evolution, and their impact on material properties in plated films
Practical, hands-on experience in electroplating process development, including bath chemistry, additives, and defect characterization is highly desirable
Pursuing a Master's or PhD degree in Chemical Engineering, Chemistry, Mechanical Engineering, or Material Science

Responsibilities

Participate in projects applying engineering and electrodeposition methodologies towards developing features on Lam SABRE 3D system to further enhance equipment and reactor performance.
Supports in the testing and characterization on development of new or modified process formulations, product development and technology support.
Setting up of and running bench scale experiments, operations of application lab deposition development tool, chemistry and material analysis, and use of metrology tools to measure and characterize on wafer deposition performance.
Data compilation and organization and conducting scientific journal research.