Principal Thermal Mechanical Photonic Designer

NVIDIA•Santa Clara, CA

7d•$232,000 - $368,000

About The Position

NVIDIA is seeking a Principal Thermal Mechanical Photonic Designer to work with its global circuits team, which develops GPUs for applications including supercomputers, gaming consoles, and self-driving cars. The team designs CMOS and silicon-photonics high-speed chip interfaces and other photonic functions. The role focuses on thermal and structural design of silicon photonic systems, thermo-mechanical modeling, reliability analysis, and experimental thermal and laser validation. The designer will support optical and system engineering leads on opto-mechanical system design and recommend design, process, or material changes based on simulations and experiments.

Requirements

PhD in Electrical Engineering, Physics, or a similar discipline, or equivalent experience, with 15+ years of experience in a related field.
8+ years of experience developing silicon photonics ICs from concept through high-volume manufacturing.
Experience in product development of optics or photonic systems.
Experience in applied research on silicon photonic ICs and systems.
Hands-on experience with silicon photonics products.
Proficiency in Ansys tools.
Background with design tools and fixtures for alignment, fabrication, gluing, and assembly of lasers, interferometers, and optical components.
Experience working, communicating, and collaborating in a cross-functional team environment.
Experience defining system performance and component specifications.
Excellent verbal and written communication skills.
Self-motivated and self-directed, with the ability to work with little supervision.

Responsibilities

Work on thermal and structural design of silicon photonic designs.
Run stress simulations for optical components and fiber alignment, and propose improved optical-component designs.
Set up experimental methodologies for thermal validation and laser performance testing under different stress conditions.
Model thermo-mechanical interactions between silicon dies and packages.
Model solder-joint fatigue and creep.
Support optical engineering and system engineering leads with opto-mechanical system design.
Predict failures in electronic packages during assembly and reliability tests, and recommend design, process, or material changes.
Analyze hygroscopic stresses in electronic packages caused by moisture diffusion.
Model crack propagation and interfacial delamination.
Perform multifaceted simulation of wire-bonding and wire-fusing processes.
Thermally characterize electronic packages and create thermal specification datasheets based on finite-element analysis and experiments according to JEDEC standards.