Thermal Principal Engineer

Dell Technologies•Franklin, MA
•$164,000 - $226,000

About The Position

Dell Technologies’ Infrastructure Solutions Group builds hardware and software for infrastructure, computational workloads, data continuity, and enterprise-scale platforms. The group incorporates AI throughout product development, with engineers defining product intent and specifications and applying human judgment to deliver trusted customer solutions. The Thermal Senior Principal Engineer will join the Network Engineer Hardware team in Franklin, Massachusetts, or Austin, Texas. The role is responsible for thermal architecture, design, and validation for next-generation Network Switches (L10) and Network L11 integrated rack solutions. The engineer will work with mechanical, electrical, hardware, power, and system engineering teams to develop cooling solutions for networking platforms supporting AI, HPC, and cloud workloads. The position uses thermal simulation, laboratory testing, characterization, and data-driven analysis to assess concepts, evaluate thermal feasibility, and optimize performance, reliability, and efficiency. It also owns key thermal technologies and roadmaps for future networking, optics, and rack-scale infrastructure solutions.

Requirements

  • Bachelor’s or master’s degree in Mechanical Engineering with a focus on thermal engineering.
  • At least 8 years of relevant industry experience.
  • Experience in CFD modeling for internal flow and electronic-cooling applications.
  • Proven experience instrumenting thermal tests and developing test plans.
  • Strong communication skills with multidisciplinary teams.
  • Strong drive to work through challenging compromises to achieve an optimal thermal solution.

Nice To Haves

  • Experience working with CREO.
  • Experience with air and liquid cooling in the server or network electronics industry.
  • Knowledge of cooling requirements for GPUs, CPUs, NPUs, or rack L11.

Responsibilities

  • Align with stakeholders on product requirements, performance metrics, and boundary conditions.
  • Develop approaches to evaluate product-concept thermal aspects while considering prototype availability, product schedules, and thermal risk.
  • Develop thermal solutions internally or with vendor partners, including heat sinks, cold plates, air movers, air shrouds, sealing, thermal interface materials, venting, and thermal controls.
  • Present findings to thermal engineers and management to identify problem areas and opportunities to improve design cost, power use, and cooling efficiency.
  • Follow existing product-development practices and procedures, and develop or improve them where necessary or desirable.
  • Own key thermal technologies and roadmaps for future networking, optics, and rack-scale infrastructure solutions.
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