Semiconductor Advanced Packaging Engineer - Irvine, California

Intermedia Group•Irvine, CA

4d•Onsite

About The Position

This position is with our Adhesive Technologies business unit – where we empower our people to transform industries and provide our customers with a competitive advantage through adhesives, sealants and functional coatings. The role is a technical service engineer who provides technical engineering support for the company's Advanced Packaging Material products and is responsible for developing in-depth application knowledge for the company's Electronics markets. Primary responsibilities include technical leadership on developmental and commercialized products by optimizing material application processes, and direct interaction with customers to troubleshoot and solve product and process-related problems. The engineer ensures that new and existing products can be successfully employed by customers in a manner that brings clear and identifiable value. This role solves technology-specific fundamental problems associated with entire product lines and/or product classes through novel approaches to application process development, troubleshooting, and material characterization.

Requirements

Minimum of a bachelor’s degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or other related fields.
10+ years of experience working in a chemical for semiconductor advanced packaging environment.
Good understanding of the latest Semiconductor Packaging trends, especially 2.5D and 3D packages.
Expertise in wafer level encapsulation and molding process in semiconductor package.
Strong verbal communication skills one-on-one with colleagues/customers as well as in front of groups.
Solid interpersonal skills.
Ability to work as a team member and independently on multi-task assignments.
Strong ownership and responsibility with a customer-oriented mindset.
Good understanding of customer requests & culture.
Effective use of project and time management skills to drive projects to completion.
Commitment to deliver the highest level of quality work consistently.

Responsibilities

Provide technical engineering support for the company's Advanced Packaging Material products.
Develop in-depth application knowledge for the company's Electronics markets.
Provide technical leadership on developmental and commercialized products by optimizing material application processes.
Directly interact with customers to troubleshoot and solve product and process-related problems.
Ensure new and existing products can be successfully employed by customers.
Solve technology-specific fundamental problems associated with entire product lines and/or product classes by novel approaches to application process development, troubleshooting, and material characterization.