Advanced Packaging Design Engineer
About The Position
Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. The Photonic Fabric Systems Packaging design team drives advanced packaging and system validation design solutions for the Photonic Fabric Business unit.
Requirements
- BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related disciplines.
- 5-10 years of experience in Semiconductor Advanced Packaging Design.
- Extensive experience working with advanced packaging design tools such as Cadence APD.
- Proven track record of experience with high density/high performance interconnects in various 2.5D/3D packaging technologies including InFO, CoWoS, FoCoS and EMIB.
- Expert understanding of cross-functional packaging areas: Si floor plan, package, board layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, assembly, reliability, and cost.
- Familiarity with MCAD tools such as AutoCAD.
- Familiarity with photonics packaging is a plus but not necessary.
- Proven track record of working with substrate vendors to meet design for manufacturing, yield, and reliability.
- Proven track record of engagement with OSATs to meet assembly requirements and drive new developments to meet new product requirements.
- Understanding of High Speed Signaling best practices, Signal and Power integrity requirements.
- Strong analytical, problem-solving, cross-functional collaboration, project management, and technical presentation skills.
Nice To Haves
- Familiarity with photonics packaging is a plus but not necessary.
Responsibilities
- Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC/PIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Marvell products.
- Scope all aspects of package substrate design feasibility for multi-chip SiP packaging.
- Lead all aspects of package layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing.
- Meet specifications for high-speed interfaces such as HBM, DDR, PCIe and SerDes.
- Netlist management for heterogeneous chiplet assemblies using latest EDA solutions.
- Supporting activities related to production and assembly of IC packages with substrate suppliers and OSATs.
- Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, driving appropriate test vehicle definition and design.
- Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Marvell.
Benefits
- employee stock purchase plan with a 2-year look back
- family support programs
- robust mental health resources
- recognition and service awards
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What This Job Offers
Job Type
Full-time
Career Level
Senior
