Principal Advanced Packaging Mechanical Engineer

Qorvo • Richardson, TX

4d

About The Position

Qorvo is looking for an experienced Principal Mechanical/Thermal Engineer to join the Defense & Aerospace product development team. The successful candidate will lead mechanical design and analysis efforts of electronics packaging for defense communications, radar and electronic warfare applications. This role involves developing next generation microelectronic packaging technology with an emphasis on advanced packaging design. The chosen candidate will work closely with a select team of IC designers, module designers, process engineers, and CAD tool set specialists to develop products and development tools to move state-of-the-art packaging technology forward. Responsibilities include developing electronic package designs for R&D prototypes and standard products, generating intellectual property with an emphasis on thermal performance and high frequency operation, and researching/evaluating emerging materials for future product offerings. The role also involves guiding package and substrate design decisions, supervising and responding to manufacturing issues, and maintaining an awareness of packaging technology trends across various semiconductor types (GaN, GaAs, Digital Si, and Analog Si) to implement these trends.

Requirements

• BSME/MSME degree in Mechanical Engineering or other relevant field with a minimum of 12 years’ experience in semiconductor packaging
• Experience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industries
• Experience with micro-fluidics within an electronics packaging environment
• Expert level skill with SolidWorks or similar
• Expert knowledge of legacy and advanced microelectronic package technologies for commercial, defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies
• Experience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense, encapsulation, and solder reflow
• Knowledge of microelectronic inspection tools and equipment including capabilities and limitations. Similar knowledge of failure analysis techniques and equipment
• Knowledge of reliability calculation methods for semiconductors
• Understanding of GD&T, ANSI standards and tolerance stack-ups required
• Demonstrated ability to work with cross-functional teams
• Excellent verbal communication and interpersonal skills
• Excellent written communications skills
• Applicants must be a US Person (US citizen, permanent resident, asylee or refugee)

Responsibilities

• Develop electronic package designs to be used for R&D prototypes and standard products
• Generate IP to drive forward packaging technology with emphasis on thermal performance and high frequency operation
• Research and evaluate emerging materials for use in future product offerings
• Guide package and substrate design decisions that meet performance specifications and yield requirements
• Supervise and respond to manufacturing issues as they occur
• Maintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si. Provide inputs to implement these technology trends

What This Job Offers

• Job Type: Full-time
• Career Level: Principal