Principal/Master Engineer – Silicon Photonics Advanced Packaging
About The Position
We are seeking a visionary Principal/Master Engineer to lead our packaging and assembly development, driving the realization of a highly scalable silicon photonics platform. In this role, you will leverage advanced 2.5D/3D packaging technologies to bridge the gap between design and volume manufacturing. As the primary technical lead and single point of contact for all packaging design and process development, you will collaborate closely with internal PIC/IC design teams, opto-mechanical designers, and assembly engineers. Externally, you will spearhead engagements with Outsource Semiconductor Assembly and Test (OSAT) partners to pioneer wafer- and chip-scale packaging processes, establish robust Design for Manufacturing (DFM) rules, and seamlessly manage New Product Introduction (NPI) through to high-volume production.
Requirements
- MS or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Optical Physics, or a related engineering discipline.
- 15+ years of hands-on experience in semiconductor advanced packaging, opto-mechanical design, silicon photonics assembly, or manufacturing operations.
- Deep, detailed understanding of wafer, chip, and board-level assembly processes, specifically 2.5D/3D integration techniques, and their distinct advantages/trade-offs when applied to photonics.
- A proven history of developing high-yielding optical products, with a strong preference for silicon photonics-based platforms.
- Demonstrated operational experience managing OSATs/CMs, including setting process control windows, troubleshooting line excursions, and directing yield engineering.
- Exceptional problem-solving skills with a track record as an independent thinker and decisive technical leader.
Responsibilities
- Serve as the lead for all advanced packaging design, substrate definition, and assembly process development activities.
- Partner with PIC, IC, opto-mechanical design and process teams to align package architectures with electrical, optical, and thermal requirements.
- Lead external OSATs/CMs through wafer and chip-scale assembly development.
- Define, document, and enforce packaging specifications and design rules.
- Troubleshoot complex assembly issues, implement risk-mitigation strategies for critical assembly nodes, and drive yield optimization to ensure a smooth transition from NPI to volume production.
- Drive the evaluation and deployment of next-generation 2.5D/3D packaging technologies, guiding cross-functional teams toward data-driven DFM decisions.
Benefits
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- company paid holidays
- paid sick leave and vacation time
- Paid Family Leave and other leaves of absence
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What This Job Offers
Job Type
Full-time
Career Level
Principal
