The Stress Testing and Reliability Laboratory is seeking a motivated, hands-on engineer to join our Environmental Stress Tool Engineering team. In this role, you will play a key part in advancing Intel's next-generation packaging technologies, including EMIB, Foveros, Hybrid Bonding, and Co-Packaged Optics, while supporting package qualification and technology development efforts. Our team develops, operates, and maintains a diverse fleet of environmental stress systems used to evaluate the reliability of Intel's silicon and package technologies under conditions that simulate real-world use, including thermal cycling, temperature extremes, and humidity exposure. We take pride in delivering trusted test environments and high-quality data that enable critical process development, qualification, and certification decisions for both internal and external stakeholders. This is an opportunity to contribute directly to cutting-edge technology while working alongside a collaborative team dedicated to engineering excellence and reliability. This role will support equipment using DC power and measurement systems, including programmable power supplies, digital multimeters, thermocouple arrays, and related electronics.
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Job Type
Full-time
Career Level
Mid Level