Plating ME Technician
About The Position
The Plating ME Technician supports manufacturing and engineering teams in the plating area and assists wafer fab production. Under the direction of the Sr. Manager, Plating Manufacturing Engineering, the technician helps ensure wafers are processed efficiently and cost-effectively, reviews and documents processes and procedures, and dispositions abnormal wafers for rework. The role maintains process controls using Statistical Process Control (SPC), collects and analyzes data, recommends corrective actions, troubleshoots equipment and process issues, and supports manufacturing-efficiency improvements. The position is based in Milpitas, California, and works primarily indoors in a Class 100 ESD-sensitive wafer manufacturing facility. The technician wears cleanroom attire and may encounter hazardous conditions, chemicals, fumes, gases, and loud noise. The schedule is Monday through Wednesday and every other Thursday, 6:00 AM to 6:00 PM; it may change to meet business or operational needs. Overtime may be required based on business needs.
Requirements
- Associate degree in Electronics, Industrial Engineering, or Manufacturing Technology, and/or equivalent relevant experience.
- Two years of experience working in the semiconductor industry in a high-volume manufacturing environment.
- Strong knowledge of electronics and manufacturing processes.
- Proficiency with Microsoft Office applications.
- Knowledge of and ability to use plating tools or wet etch equipment.
- Knowledge of semiconductor and hard disk drive industry principles, practices, and techniques.
- Ability to use MS Office, including Word, Excel, PowerPoint, and Access, to analyze data and create documents, spreadsheets, and presentations.
- Knowledge of and ability to use SPC to maintain process controls.
- Ability to collect and analyze data using SPC, present findings, and recommend corrective action.
- Ability to troubleshoot tools and tool sets to minimize downtime.
- Ability to adhere to safety policies and procedures.
- Ability to communicate verbally and in writing with contractors, consultants, employees, management, and vendors.
- Demonstrated problem-solving ability.
- Time-management skills.
- Ability to resolve issues quickly and efficiently.
- Flexibility and ability to prioritize.
Responsibilities
- Support manufacturing and engineering teams in the plating area.
- Support wafer fab production and manufacturing processes to ensure wafers are processed efficiently and cost-effectively.
- Review and document processes and procedures, and partner with engineering to implement changes with minimal disruption.
- Disposition abnormal or atypical wafers for rework and ensure rework is completed promptly.
- Collect and analyze data and recommend corrective action when required.
- Review and maintain process controls using SPC and prepare charts and graphs as needed.
- Assist with troubleshooting tools and process issues in the plating area.
- Participate in and recommend procedure or process modifications to support continuous improvement.
- Assist with training and certifying operators on tools and manufacturing processes.
- Collaborate with manufacturing or engineering to qualify or approve new processes or procedures and assist with identifying production integration timelines.
- Respond to inquiries from team members, managers, or departments.
- Adhere to required safety policies and procedures.
- Perform other duties of a similar nature or level.
Benefits
- Benefits are offered.
- Bonus target.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Education Level
Associate degree
