Plating ME Technician (53577)

Headway Technologies•Milpitas, CA

1d•Onsite

About The Position

The Plating ME Technician supports manufacturing and engineering teams in the plating area and assists wafer fab production. The role reviews and documents processes and procedures, dispositions abnormal wafers for rework, maintains process controls using Statistical Process Control (SPC), collects and analyzes data, recommends corrective actions, and supports manufacturing-efficiency improvements. The position is located in Milpitas, California, and reports to the Sr. Manager, Plating Manufacturing Engineering. The technician works primarily indoors in a Class 100, ESD-sensitive wafer manufacturing facility. The role requires wearing cleanroom attire, including a hood, gloves, safety glasses, booties, and mask. Work may involve travel between buildings, exposure to hazardous conditions, chemicals, fumes, gases, or loud noise, and occasional pushing, pulling, or lifting up to 30 pounds. The stated schedule is Monday through Wednesday and every other Thursday, 6:00 a.m. to 6:00 p.m.; it may change to meet business or operational needs.

Requirements

Associate degree in Electronics, Industrial Engineering, or Manufacturing Technology, and/or equivalent relevant experience.
Two years of experience working in the semiconductor industry in a high-volume manufacturing environment.
Strong knowledge of electronics and manufacturing processes.
Proficiency with Microsoft Office applications.
Knowledge of and ability to use plating tools or wet etch equipment.
Knowledge of semiconductor and hard disk drive industry principles, practices, and techniques.
Ability to use Microsoft Word, Excel, PowerPoint, and Access to analyze data and create documents, spreadsheets, and presentations.
Knowledge of and ability to use SPC to maintain process controls.
Ability to collect and analyze data using SPC, present findings, and recommend corrective action.
Ability to troubleshoot tools and tool sets to help ensure minimal downtime.
Ability to adhere to safety policies and procedures.
Ability to communicate verbally and in writing with contractors, consultants, employees, management, and vendors.
Demonstrated problem-solving ability.
Time-management skills.
Ability to resolve issues quickly and efficiently.
Flexibility and ability to prioritize.

Responsibilities

Provide support to manufacturing and engineering teams in the plating area.
Support wafer fab production and manufacturing processes to ensure wafers are processed efficiently and cost effectively.
Review and document processes and procedures, and partner with engineering to implement changes effectively with minimal disruption.
Disposition abnormal or atypical wafers for rework and ensure rework is completed promptly.
Collect and analyze data and recommend corrective action when required.
Review and maintain process controls using SPC, and prepare charts and graphs as needed.
Assist with troubleshooting tools and process issues in the plating area.
Participate in and recommend procedure or process modifications to support continuous improvement initiatives.
Assist with training and certifying operators on tools and manufacturing processes.
Collaborate with manufacturing or engineering to qualify or approve new processes or procedures and assist with identifying production integration timelines.
Respond to inquiries from team members, managers, or departments.
Adhere to required safety policies and procedures.
Perform other duties of a similar nature or level.