Applied Materials is seeking a highly motivated PhD-level scientist or engineer to develop and apply advanced modeling capabilities for plasma processing applications, including plasma etching, plasma-enhanced deposition, and atomic layer etching (ALE). The role focuses on understanding, modeling, and predicting plasma–surface interaction processes using physics-based methods and data-driven approaches. The successful candidate will use atomistic and mesoscale modeling techniques such as ab initio quantum chemistry, molecular dynamics (MD), and kinetic Monte Carlo (kMC). They will also develop and deploy machine learning models trained on data from large-scale, multidimensional high-performance computing (HPC) simulations, complemented by experimental measurements. The position brings together first-principles modeling, large-scale simulation, and AI/ML methods to support accelerated technology and product development in the semiconductor equipment industry. The role is based in Santa Clara, California. It is a full-time, new-college-graduate position and involves travel 10% of the time. Relocation is eligible. Applications are reviewed on a rolling basis; applicants are asked to apply by November 20, 2026, though the position may close earlier depending on application volume or candidate selection.
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Job Type
Full-time
Career Level
Entry Level
Education Level
Ph.D. or professional degree