Physical Failure Analysis Engineer

Apple • Austin, TX

7d

About The Position

At Apple, the Physical Failure Analysis Engineer delivers failure analysis and characterization solutions for next-generation materials, silicon devices, and advanced products, collaborating with multifunctional teams to support product launches. The role partners directly with cross-functional teams to evaluate incoming failure analysis requests, define analytical strategies, and perform hands-on physical preparation for root-cause isolation.

Responsibilities include preparing silicon, packaged components, and multilayer boards using advanced CNC mechanical polishers, chemical and dry etching, and precision cross-sectioning techniques. The engineer provides samples optimized for high-resolution imaging, micro-probing, and nano-probing, and communicates analytical findings to engineering teams and upper management. The position calls for expert craftsmanship, creativity, and analytical rigor to help ensure products are delivered on time.

Requirements

• B.S. with 4+ years, A.A. with 6+ years, or High School Diploma with 8+ years of relevant hands-on failure analysis sample preparation experience.
• Deep understanding of fundamental failure analysis methodologies, defect isolation workflows, and sample preparation principles.
• Extensive hands-on experience with mechanical cross-sectioning, encapsulation, and iterative planar polishing.
• Extensive hands-on experience with CNC-based polishers, decapsulation, and parallel lapping of multilayer boards and packaged die.
• Hands-on proficiency with wet and dry etch methods for sample de-processing and material removal.
• Proficiency in optical microscopy and basic understanding of mechanical and microelectronic assemblies.
• Strong 3D spatial awareness and ability to visualize and reconstruct internal device architectures in three dimensions.
• Proven ability to independently troubleshoot preparation challenges, prioritize tasks, and complete projects under tight deadlines.
• Strong technical writing, reporting, and verbal communication skills in English.
• Ability to collaborate effectively across multidisciplinary engineering organizations.

Nice To Haves

• Hands-on experience with Focused Ion Beam (FIB) cross-sectioning and circuit edit techniques.
• Experience preparing samples specifically tailored for nano-probing and micro-probing on sub-micron or advanced silicon nodes.
• Hands-on experience with advanced broad-beam argon ion milling (BIB) for artifact-free cross-sectional and planar polishing.
• Practical knowledge and operational familiarity with SEM and EDS.
• Experience supporting failure analysis for advanced packaging, including multi-chip modules, SiP, 2.5D/3D architectures, or complex micro-electronic assemblies.
• Working knowledge of analytical techniques such as FT-IR and GC, or specialized chemical de-processing workflows.
• Ability to establish standardized operating procedures (SOPs) and training modules for precision sample preparation.

Responsibilities

• Evaluate incoming failure analysis requests with cross-functional teams.
• Define appropriate analytical strategies for root-cause isolation.
• Perform hands-on physical preparation of silicon, packaged components, and multilayer boards.
• Use mechanical polishing, chemical and dry etching, and precision cross-sectioning techniques to prepare samples.
• Prepare samples optimized for high-resolution imaging, micro-probing, and nano-probing.
• Convey analytical findings to engineering teams and upper management.

What This Job Offers

• Job Type: Full-time