Intern- YE Physical Failure Analysis Engineer

Micron•Boise, ID

About The Position

As a PFA Engineer Intern on Micron Technology’s Yield Enhancement (YE) team, you will support physical failure analysis investigations of defect issues identified by YE and fab customers. You will learn to isolate, expose, and image physical defects in advanced memory devices, analyze results to help determine root causes, and present findings to engineering partners. Daily work takes place in the lab, with priorities guided by the YE PFA queue and a mentor engineer. During the three-month internship, you will also complete a focused improvement project and present its results at the end of the program. The internship includes physical failure analysis and investigation, safe operation of lab equipment, technical learning, and participation in continuous-improvement work. You will complete required safety and equipment training, build knowledge of device structures, process flows, and failure mechanisms, and use approved AI and digital productivity tools responsibly to support analysis and documentation while protecting data and intellectual property. This is a three-month, full-time, day-shift internship scheduled Monday through Friday. Applicants must be pursuing a bachelor’s or master’s degree in Electrical Engineering, Materials Science and Engineering, Physics, Chemical Engineering, or a related field. No prior industry experience is required.

Requirements

Currently pursuing a bachelor’s or master’s degree in Electrical Engineering, Materials Science and Engineering, Physics, Chemical Engineering, or a related field.
Basic understanding of semiconductor devices and fabrication processes.
Strong attention to detail and good analytical and problem-solving skills.
Clear written and verbal communication skills, including the ability to summarize technical results simply.
No prior industry experience is required.

Nice To Haves

Hands-on laboratory experience, such as microscopy, SEM/FIB, sample preparation, or cleanroom work.
Familiarity with data tools such as Excel, JMP, or Python.
Previous internships or research projects in semiconductors or failure analysis.

Responsibilities

Prepare and analyze PFA samples, including deprocessing or delayering, cross-sectioning, FIB, and SEM/TEM imaging, following area skill guidelines.
Review EFA results, fault-isolation data, and probe or yield data to determine where to target physical analysis.
Identify and categorize physical defect signatures using defect references and help characterize new or unknown defect types.
Analyze data to support PFA results and determine likely root causes.
Prepare concise reports describing images, defect locations, and likely root causes, and communicate findings to part owners and YE/Fab engineers.
Learn to operate PFA lab equipment safely and efficiently in accordance with safety and contamination-control guidelines.
Develop an understanding of equipment operation and support basic troubleshooting with equipment owners.
Own a focused project that fits the three-month internship timeline and present its outcome to the team and leadership.
Complete required safety and equipment training certifications defined by area guidelines.
Build technical knowledge of device structure, process flow, and failure mechanisms for current and future parts.
Suggest departmental improvements and participate in team projects supporting department and company objectives.
Use approved AI and digital productivity tools to support data analysis, image and report generation, knowledge retrieval, problem-solving, documentation, communication, and investigation workflows.
Use AI technologies responsibly, follow company policies and data-protection requirements, protect intellectual property, and apply engineering judgment to ensure accuracy.