PCB Manufacturing Process Engineer - Mechanical & Laser Drilling

Advantest•South Plainfield, NJ

About The Position

The PCB Manufacturing Process Engineer (Mechanical & Laser Drilling) develops, optimizes, and sustains drilling processes used in advanced printed circuit board manufacturing. The role supports mechanical and laser drilling operations to improve production efficiency, product quality, capacity, and capability. It works with Front End Engineering, Quality, CAM, Maintenance, and Production teams to maintain robust process capability for advanced ATE (Automated Test Equipment) PCBs, including load boards, probe cards, and interposers used in semiconductor testing. The engineer develops and controls mechanical drilling processes and optimizes UV and CO₂ laser drilling for HDI microvia applications. The role also supports process improvement and quality, equipment performance and qualification, and cross-functional manufacturing activities. It provides technical guidance and training to operators, technicians, and manufacturing personnel.

Requirements

Bachelor's degree in Mechanical Engineering, Manufacturing Engineering, Materials Science, Industrial Engineering, or a related technical discipline.

Nice To Haves

Three or more years of PCB manufacturing experience is preferred but not mandatory.
Experience with mechanical drilling and/or laser drilling processes in PCB fabrication is a plus.

Responsibilities

Develop, optimize, and control mechanical drilling processes for PCB fabrication.
Establish mechanical drilling parameters, including spindle speeds, feed rates, stack heights, entry and backup materials, and tool selection.
Monitor drilling performance and implement continuous improvement initiatives to improve hole quality and productivity.
Troubleshoot hole location accuracy, burr formation, nail-heading, smear, breakout, drill breakage, and hole wall quality issues.
Support new product introductions by establishing drilling process requirements and capabilities.
Develop and optimize UV and CO₂ laser drilling processes for HDI microvia applications.
Monitor microvia quality and yields.
Conduct and document process capability for specific materials and via geometries.
Use SPC, DOE, Lean Manufacturing, and Six Sigma methodologies to improve process capability.
Develop and maintain process documentation, specifications, and control plans.
Lead root-cause investigations using structured problem-solving tools, including 8D, Fishbone Analysis, 5 Why, and FMEA.
Support internal and external audits related to manufacturing processes.
Analyze process data and drive yield, quality, and productivity improvements.
Establish KPIs and process monitoring systems for drilling operations.
Collaborate with maintenance teams to maximize equipment uptime and performance.
Support installation, qualification, and acceptance of new drilling and laser equipment.
Develop preventive maintenance and calibration requirements.
Participate in equipment capability assessments and technology evaluations.
Work with CAM, Lamination, Plating, Quality, and Production departments.
Support design reviews and manufacturing feasibility assessments.
Provide technical guidance and training to operators, technicians, and manufacturing personnel.